Inventor

GLOVATSKY ANDREW Z

US40 patents

⚠️ This page may combine multiple inventors who share the name “GLOVATSKY ANDREW Z”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOVATSKY ANDREW Z

VISTEON GLOBAL TECH INC

Apparatus for routing electrical signals in an engine

Microelectronic package with tubular housing

LED interconnect spring clip assembly

Microelectronic package within cylindrical housing

Liquid cooled metal thermal stack for high-power dies

Apparatus for routing electrical signals in an engine

Assembly comprising multiple microelectronic modules

Vented circuit board for cooling power components

Electronically integrated vehicle support structure

Vehicle instrument panel structure to support electronics packaging

Mountable microelectronic package

LED interconnection integrated connector holder package

Integrated powertrain control system for large engines

Electrical circuit board and a method for making the same

Light weight portable phased array antenna

Electrical circuit board and a method for making the same

Integrated fuel delivery and electronic powertrain control module and method of manufacture

Method for making an electrical circuit board

Electronically integrated vehicle structure

Method of making an electrical circuit board

Method for creating a connection within a multilayer circuit board assembly

Method for making an electrical circuit board

FORD MOTOR CO

Predeposited transient phase electronic interconnect media

Three-dimensional molded sockets for mechanical and electrical component attachment

Circuit clip connector

Enhanced plating adhesion through the use of metallized fillers in plastic substrate

Controlled zone solder dispensing

Method of manufacturing a circuit assembly from two or more layers of flexible film

Apparatus for cooling printed circuit boards in wave soldering

Method of improved oven reflow soldering

Laser-solderable electronic component

Method for adhering a metallization to a substrate

IBM

Electronic assembly with flexible film cover for providing electrical and environmental protection

Localized soldering station using state changing medium

LOCKHEED CORP

Hermetically sealed high density multi-chip package

FORD GLOBAL TECH INC

Three-dimensional multi-layer circuit structure and method for forming the same

LORAL FEDERAL SYSTEMS COMPANY

Method of manufacturing a flexible metallized polymer film cover for environmental protection of electronic assemblies

(unassigned)

Flatwire jumper patch

GLOVATSKY ANDREW Z

Lighting system for appliance

FORD MOTOR COMPANY INC

Circuit-carrying automotive component and method of manufacturing the same