Inventor
HARUTA RYO
JP23 patents
⚠️ This page may combine multiple inventors who share the name “HARUTA RYO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
15 patentsUS6232650B1May 15, 2001
Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting
HITACHI LTD94 citations98
US5336638AAug 9, 1994
Process for manufacturing semiconductor devices
HITACHI LTD129 citations97
US6404049B1Jun 11, 2002
Semiconductor device, manufacturing method thereof and mounting board
HITACHI LTD59 citations96
US6476467B2Nov 5, 2002
Semiconductor device and process for producing the same
HITACHI LTD56 citations95
US6512176B2Jan 28, 2003
Semiconductor device
HITACHI LTD23 citations92
US6465876B1Oct 15, 2002
Semiconductor device and lead frame therefor
HITACHI LTD16 citations92
US6340793B1Jan 22, 2002
Semiconductor device
HITACHI LTD37 citations92
US6278176B1Aug 21, 2001
Semiconductor device and process for producing the same
HITACHI LTD24 citations92
US6060770AMay 9, 2000
Semiconductor device and process for producing the same
HITACHI LTD23 citations92
US5140272AAug 18, 1992
Method of semiconductor surface measurment and an apparatus for realizing the same
HITACHI LTD34 citations92
US6621160B2Sep 16, 2003
Semiconductor device and mounting board
HITACHI LTD13 citations84
US6590275B2Jul 8, 2003
Ball grid array type semiconductor package having a flexible substrate
HITACHI LTD10 citations82
US6563212B2May 13, 2003
Semiconductor device
HITACHI LTD12 citations74
US4570175AFeb 11, 1986
Three-dimensional semiconductor device with thin film monocrystalline member contacting substrate at a plurality of locations
HITACHI LTD11 citations74
US6120301ASep 19, 2000
Semiconductor device and method of manufacturing the same
HITACHI LTD11 citations68
RENESAS TECH CORP
4 patentsUS6897570B2May 24, 2005
Semiconductor device and method of manufacturing same
RENESAS TECH CORP54 citations95
US6764878B2Jul 20, 2004
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate
RENESAS TECH CORP13 citations92
US6844219B2Jan 18, 2005
Semiconductor device and lead frame therefor
RENESAS TECH CORP2 citations63
US6759279B2Jul 6, 2004
Method of manufacturing semiconductor device having resin sealing body
RENESAS TECH CORP2 citations62
HITACHI HOKKAI SEMICONDUCTOR
4 patentsUS6437428B1Aug 20, 2002
Ball grid array type semiconductor package having a flexible substrate
HITACHI HOKKAI SEMICONDUCTOR9 citations81
US6887739B2May 3, 2005
Method of manufacturing semiconductor package including forming a resin sealing member
HITACHI HOKKAI SEMICONDUCTOR5 citations73
US6476466B2Nov 5, 2002
Ball grid array type semiconductor package having a flexible substrate
HITACHI HOKKAI SEMICONDUCTOR4 citations73
US6448111B1Sep 10, 2002
Method of manufacturing a semiconductor device
HITACHI HOKKAI SEMICONDUCTOR4 citations73