Inventor

NGUYEN LUU THANH

US34 patents

⚠️ This page may combine multiple inventors who share the name “NGUYEN LUU THANH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NGUYEN LUU THANH

NAT SEMICONDUCTOR CORP

Techniques for manufacturing flash-free contacts on a semiconductor package

Integrated circuit package with stress reduction

Optoelectronic package with dam structure to provide fiber standoff

Techniques for joining an opto-electronic module to a semiconductor package

Optoelectronic package with controlled fiber standoff

Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards

Miniature semiconductor package for opto-electronic devices

Techniques for joining an opto-electronic module to a semiconductor package

Techniques for joining an opto-electronic module to a semiconductor package

Optical sub-assembly for opto-electronic modules

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

Optical sub-assembly for optoelectronic modules

Techniques for maintaining parallelism between optical and chip sub-assemblies

Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package

Optical sub-assembly packaging techniques that incorporate optical lenses

Techniques for joining an opto-electronic module to a semiconductor package

Techniques for joining an opto-electronic module to a semiconductor package

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

Two-layer electrical substrate for optical devices

Ceramic optical sub-assembly for optoelectronic modules

Optical sub-assembly packaging techniques that incorporate optical lenses

Optical sub-assembly packaging techniques that incorporate optical lenses

Two-layer electrical substrate for optical devices

Ceramic optical sub-assembly for optoelectronic modules

TEXAS INSTRUMENTS INC

Printed repassivation for wafer chip scale packaging

Copper passivation

Bump bond structure for enhanced electromigration performance

Integrated circuit backside metallization

Packaged semiconductor device with multilayer stress buffer

Integrated circuit backside metallization

Bump bond structure for enhanced electromigration performance

Additive deposition low temperature curable magnetic interconnecting layer for power components integration

Fan-out electronic device

IBM

Solder deposition system