Inventor

PHAM KEN

US34 patents

⚠️ This page may combine multiple inventors who share the name “PHAM KEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PHAM KEN

NAT SEMICONDUCTOR CORP

Techniques for manufacturing flash-free contacts on a semiconductor package

Leadframe panel

Wire bonding deflector for a wire bonder

Post singulation die separation apparatus and method for bulk feeding operation

Optoelectronic package with dam structure to provide fiber standoff

Techniques for joining an opto-electronic module to a semiconductor package

Optoelectronic package with controlled fiber standoff

Metal coated markings on integrated circuit devices

Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards

Miniature semiconductor package for opto-electronic devices

Electrical connector for opto-electronic modules

Techniques for joining an opto-electronic module to a semiconductor package

Techniques for joining an opto-electronic module to a semiconductor package

Optical sub-assembly for opto-electronic modules

Post singulation die separation apparatus and method for bulk feeding operation

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

Optical sub-assembly for optoelectronic modules

Techniques for maintaining parallelism between optical and chip sub-assemblies

Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package

Techniques for joining an opto-electronic module to a semiconductor package

Techniques for joining an opto-electronic module to a semiconductor package

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

Ceramic optical sub-assembly for optoelectronic modules

Encapsulant material applicator for semiconductor wafers and method of use thereof

Ceramic optical sub-assembly for optoelectronic modules

TEXAS INSTRUMENTS INC

Semiconductor systems having premolded dual leadframes

Half bridge ceramic hermetic package structure

Packaged semiconductor device including heat slug

Stacked die semiconductor package

Spot-solderable leads for semiconductor device packages

Semiconductor systems having dual leadframes

Spot-solderable leads for semiconductor device packages

PHAM KEN

Lead frame interconnect scheme with high power density

Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds