Inventor
MAZOTTI WILLIAM PAUL
US24 patents
Patents
24 patentsUS6989122B1Jan 24, 2006
Techniques for manufacturing flash-free contacts on a semiconductor package
NAT SEMICONDUCTOR CORP62 citations96
US6655854B1Dec 2, 2003
Optoelectronic package with dam structure to provide fiber standoff
NAT SEMICONDUCTOR CORP31 citations92
US6642613B1Nov 4, 2003
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP13 citations92
US6595699B1Jul 22, 2003
Optoelectronic package with controlled fiber standoff
NAT SEMICONDUCTOR CORP40 citations92
US6749345B1Jun 15, 2004
Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards
NAT SEMICONDUCTOR CORP28 citations91
US7156562B2Jan 2, 2007
Opto-electronic module form factor having adjustable optical plane height
NAT SEMICONDUCTOR CORP38 citations88
US7247942B2Jul 24, 2007
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP5 citations74
US6858468B2Feb 22, 2005
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP4 citations74
US7086788B2Aug 8, 2006
Optical sub-assembly for opto-electronic modules
NAT SEMICONDUCTOR CORP5 citations73
US7001083B1Feb 21, 2006
Technique for protecting photonic devices in optoelectronic packages with clear overmolding
NAT SEMICONDUCTOR CORP6 citations73
US6916121B2Jul 12, 2005
Optical sub-assembly for optoelectronic modules
NAT SEMICONDUCTOR CORP11 citations73
US6628000B1Sep 30, 2003
Techniques for maintaining parallelism between optical and chip sub-assemblies
NAT SEMICONDUCTOR CORP10 citations73
US6973225B2Dec 6, 2005
Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package
NAT SEMICONDUCTOR CORP8 citations72
US6863450B2Mar 8, 2005
Optical sub-assembly packaging techniques that incorporate optical lenses
NAT SEMICONDUCTOR CORP11 citations71
US7199440B2Apr 3, 2007
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP2 citations63
US6838317B2Jan 4, 2005
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP2 citations63
US7195955B2Mar 27, 2007
Technique for protecting photonic devices in optoelectronic packages with clear overmolding
NAT SEMICONDUCTOR CORP2 citations62
US6765275B1Jul 20, 2004
Two-layer electrical substrate for optical devices
NAT SEMICONDUCTOR CORP2 citations62
US7023705B2Apr 4, 2006
Ceramic optical sub-assembly for optoelectronic modules
NAT SEMICONDUCTOR CORP5 citations61
US7431516B2Oct 7, 2008
Optical sub-assembly packaging techniques that incorporate optical lenses
NAT SEMICONDUCTOR CORP1 citations60
US7073961B2Jul 11, 2006
Optical sub-assembly packaging techniques that incorporate optical lenses
NAT SEMICONDUCTOR CORP2 citations60
US6985668B2Jan 10, 2006
Multi-purpose optical light pipe
NAT SEMICONDUCTOR CORP2 citations58
US7432575B2Oct 7, 2008
Two-layer electrical substrate for optical devices
NAT SEMICONDUCTOR CORP0 citations51
US7269027B2Sep 11, 2007
Ceramic optical sub-assembly for optoelectronic modules
NAT SEMICONDUCTOR CORP0 citations40