Inventor
ROBERTS BRUCE CARLTON
US20 patents
Patents
20 patentsUS6655854B1Dec 2, 2003
Optoelectronic package with dam structure to provide fiber standoff
NAT SEMICONDUCTOR CORP31 citations92
US6642613B1Nov 4, 2003
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP13 citations92
US6595699B1Jul 22, 2003
Optoelectronic package with controlled fiber standoff
NAT SEMICONDUCTOR CORP40 citations92
US6749345B1Jun 15, 2004
Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards
NAT SEMICONDUCTOR CORP28 citations91
US6767140B2Jul 27, 2004
Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology
NAT SEMICONDUCTOR CORP15 citations81
US7247942B2Jul 24, 2007
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP5 citations74
US6858468B2Feb 22, 2005
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP4 citations74
US7086788B2Aug 8, 2006
Optical sub-assembly for opto-electronic modules
NAT SEMICONDUCTOR CORP5 citations73
US7001083B1Feb 21, 2006
Technique for protecting photonic devices in optoelectronic packages with clear overmolding
NAT SEMICONDUCTOR CORP6 citations73
US6916121B2Jul 12, 2005
Optical sub-assembly for optoelectronic modules
NAT SEMICONDUCTOR CORP11 citations73
US6628000B1Sep 30, 2003
Techniques for maintaining parallelism between optical and chip sub-assemblies
NAT SEMICONDUCTOR CORP10 citations73
US6973225B2Dec 6, 2005
Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package
NAT SEMICONDUCTOR CORP8 citations72
US7199440B2Apr 3, 2007
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP2 citations63
US6838317B2Jan 4, 2005
Techniques for joining an opto-electronic module to a semiconductor package
NAT SEMICONDUCTOR CORP2 citations63
US7195955B2Mar 27, 2007
Technique for protecting photonic devices in optoelectronic packages with clear overmolding
NAT SEMICONDUCTOR CORP2 citations62
US6765275B1Jul 20, 2004
Two-layer electrical substrate for optical devices
NAT SEMICONDUCTOR CORP2 citations62
US7023705B2Apr 4, 2006
Ceramic optical sub-assembly for optoelectronic modules
NAT SEMICONDUCTOR CORP5 citations61
US7432575B2Oct 7, 2008
Two-layer electrical substrate for optical devices
NAT SEMICONDUCTOR CORP0 citations51
US7086786B2Aug 8, 2006
Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology
NAT SEMICONDUCTOR CORP0 citations49
US7269027B2Sep 11, 2007
Ceramic optical sub-assembly for optoelectronic modules
NAT SEMICONDUCTOR CORP0 citations40