Inventor
MAEKAWA IWAO
JP22 patents
⚠️ This page may combine multiple inventors who share the name “MAEKAWA IWAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
20 patentsUS6099678AAug 8, 2000
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
HITACHI CHEMICAL CO LTD61 citations94
US4732702AMar 22, 1988
Electroconductive resin paste
HITACHI CHEMICAL CO LTD45 citations92
US6825249B1Nov 30, 2004
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
HITACHI CHEMICAL CO LTD17 citations82
US4370446AJan 25, 1983
Method for manufacture of polybutadiene-modified unsaturated polyester
HITACHI CHEMICAL CO LTD26 citations77
US4100120AJul 11, 1978
Resinous composition
HITACHI CHEMICAL CO LTD20 citations77
US4338427AJul 6, 1982
Process for producing polyimide-amide-carboxylic acid
HITACHI CHEMICAL CO LTD15 citations74
US6855579B2Feb 15, 2005
Semiconductor device and process for fabrication thereof
HITACHI CHEMICAL CO LTD6 citations73
US6717242B2Apr 6, 2004
Semiconductor device and process for fabrication thereof
HITACHI CHEMICAL CO LTD12 citations73
US4490496ADec 25, 1984
Moistureproof insulating coating composition for packing circuit boards
HITACHI CHEMICAL CO LTD12 citations72
US4228251AOct 14, 1980
Resin composition having low shrink properties
HITACHI CHEMICAL CO LTD16 citations71
US4367314AJan 4, 1983
Resin composition
HITACHI CHEMICAL CO LTD10 citations70
US4224430ASep 23, 1980
Resinous composition
HITACHI CHEMICAL CO LTD18 citations70
US4233413ANov 11, 1980
Resin composition with low shrinkage
HITACHI CHEMICAL CO LTD13 citations69
US4264754AApr 28, 1981
Oligomers and a method for the manufacture thereof
HITACHI CHEMICAL CO LTD3 citations63
US7387914B2Jun 17, 2008
Semiconductor device and process for fabrication thereof
HITACHI CHEMICAL CO LTD2 citations62
US7078094B2Jul 18, 2006
Semiconductor device and process for fabrication thereof
HITACHI CHEMICAL CO LTD2 citations62
US7057265B2Jun 6, 2006
Semiconductor device and process for fabrication thereof
HITACHI CHEMICAL CO LTD3 citations62
US7012320B2Mar 14, 2006
Semiconductor device and process for fabrication thereof
HITACHI CHEMICAL CO LTD2 citations62
US4245067AJan 13, 1981
Thermosetting resin composition
HITACHI CHEMICAL CO LTD2 citations62
US7781896B2Aug 24, 2010
Semiconductor device and process for fabrication thereof
HITACHI CHEMICAL CO LTD0 citations52