Inventor

LEHNER RUDOLF

DE13 patents

⚠️ This page may combine multiple inventors who share the name “LEHNER RUDOLF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

12 patents

US6867492B2Mar 15, 2005

Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module

INFINEON TECHNOLOGIES AG96 citations96

US6694707B2Feb 24, 2004

Apparatus and method for populating transport tapes

INFINEON TECHNOLOGIES AG17 citations92

US7417198B2Aug 26, 2008

Radiofrequency power semiconductor module with cavity housing, and method for producing it

INFINEON TECHNOLOGIES AG29 citations91

US10710210B2Jul 14, 2020

Method for forming semiconductor devices

INFINEON TECHNOLOGIES AG1 citations71

US10307884B2Jun 4, 2019

Apparatus for controlling a movement of a grinding wheel, semiconductor wafer grinding system and method for forming semiconductor devices

INFINEON TECHNOLOGIES AG2 citations71

US9536816B2Jan 3, 2017

Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

INFINEON TECHNOLOGIES AG5 citations68

US6895731B2May 24, 2005

Apparatus for populating transport tapes

INFINEON TECHNOLOGIES AG2 citations62

US10974365B2Apr 13, 2021

Method for processing semiconductor wafers using a grinding wheel

INFINEON TECHNOLOGIES AG0 citations61

US7259088B2Aug 21, 2007

Apparatus for singulating and bonding semiconductor chips, and method for the same

INFINEON TECHNOLOGIES AG3 citations61

US6906428B2Jun 14, 2005

Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component

INFINEON TECHNOLOGIES AG4 citations61

US11557505B2Jan 17, 2023

Method of manufacturing a template wafer

INFINEON TECHNOLOGIES AG0 citations51

US7245026B2Jul 17, 2007

Configuration and method for contacting circuit structure

INFINEON TECHNOLOGIES AG0 citations51

SILTRONIC AG

1 patent

US7754009B2Jul 13, 2010

Unpolished semiconductor wafer and method for producing an unpolished semiconductor wafer

SILTRONIC AG2 citations58