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Inventor

MIS J DANIEL

US11 patents
⚠️ This page may combine multiple inventors who share the name “MIS J DANIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITIVE INT LTD

5 patents
US7427557B2Sep 23, 2008

Methods of forming bumps using barrier layers as etch masks

UNITIVE INT LTD28 citations92
US7834454B2Nov 16, 2010

Electronic structures including barrier layers defining lips

UNITIVE INT LTD9 citations84
US7839000B2Nov 23, 2010

Solder structures including barrier layers with nickel and/or copper

UNITIVE INT LTD11 citations79
US7547623B2Jun 16, 2009

Methods of forming lead free solder bumps

UNITIVE INT LTD11 citations79
US7665652B2Feb 23, 2010

Electronic devices including metallurgy structures for wire and solder bonding

UNITIVE INT LTD6 citations71

AMKOR TECHNOLOGY INC

2 patents
US7358174B2Apr 15, 2008

Methods of forming solder bumps on exposed metal pads

AMKOR TECHNOLOGY INC29 citations92
US7994043B1Aug 9, 2011

Lead free alloy bump structure and fabrication method

AMKOR TECHNOLOGY INC5 citations62

IBM

2 patents
US5470781ANov 28, 1995

Method to reduce stress from trench structure on SOI wafer

IBM22 citations92
US5171642ADec 15, 1992

Multilayered intermetallic connection for semiconductor devices

IBM33 citations92

UNITIVIE INTERNAT LTD

1 patent
US6762122B2Jul 13, 2004

Methods of forming metallurgy structures for wire and solder bonding

UNITIVIE INTERNAT LTD131 citations95

RINNE GLENN A

1 patent
US8487432B2Jul 16, 2013

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

RINNE GLENN A3 citations59