Inventor

ESTACIO MARIA CRISTINA B

PH25 patents

⚠️ This page may combine multiple inventors who share the name “ESTACIO MARIA CRISTINA B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ESTACIO MARIA CRISTINA B

FAIRCHILD SEMICONDUCTOR

Semiconductor die package including carrier with mask

Semiconductor die package processable at the wafer level

Semiconductor die package with semiconductor die having side electrical connection

Multichip module including substrate with an array of interconnect structures

Semiconductor device including stacked dies mounted on a leadframe

Flip clip attach and copper clip attach on MOSFET device

Method for making power chip scale package

Pre-molded clip structure

Pre-molded clip structure

MOSFET device with multiple gate contacts offset from gate contact area and over source area

Method for forming semiconductor device including stacked dies

Semiconductor die package including exposed connections

Flip clip attach and copper clip attach on MOSFET device

Flip chip MLP with conductive ink

Supporting gate contacts over source region on MOSFET devices

Pre-molded clip structure

Semiconductor die package and method for making the same

JEON OSEOB

Semiconductor die package and method for making the same

Semiconductor die package and method for making the same

QUINONES MARIA CLEMENS Y

Semiconductor die package including low stress configuration

Semiconductor die package including low stress configuration

FAIRCHILD KR SEMICONDUCTOR LTD

Molded leadless package having a partially exposed lead frame pad

FAIRCHILD SEMICONDUCTOR INC

Power chip scale package

CRUZ ERWIN VICTOR

Pre-molded clip structure

CHOI SEUNG-YONG

Flip chip MLP with conductive ink