Inventor

Fukuchi Kyle

US2 patents

Patents

2 patents

US9641254B1May 2, 2017

Heat dissipation approach in chip on board assembly by using stacked copper microvias

GOOGLE INC29 citations92

US9918377B1Mar 13, 2018

Heat dissipation approach in chip on board assembly by using stacked copper Microvias

GOOGLE INC5 citations82