Inventor
MANDAL SUDEEP
IN32 patents
⚠️ This page may combine multiple inventors who share the name “MANDAL SUDEEP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS9536732B2Jan 3, 2017
Low temperature fabrication of lateral thin film varistor
IBM5 citations84
US9356089B1May 31, 2016
Low temperature fabrication of lateral thin film varistor
IBM4 citations84
US9184112B1Nov 10, 2015
Cooling apparatus for an integrated circuit
IBM18 citations84
US10393532B2Aug 27, 2019
Emergency responsive navigation
IBM5 citations73
US9913405B2Mar 6, 2018
Glass interposer with embedded thermoelectric devices
IBM2 citations73
US9472483B2Oct 18, 2016
Integrated circuit cooling apparatus
IBM3 citations73
US9569571B1Feb 14, 2017
Method and system for timing violations in a circuit
IBM2 citations69
US10170224B2Jan 1, 2019
Low temperature fabrication of lateral thin film varistor
IBM0 citations52
US9870851B2Jan 16, 2018
Low temperature fabrication of lateral thin film varistor
IBM0 citations52
US9865674B2Jan 9, 2018
Low temperature fabrication of lateral thin film varistor
IBM0 citations52
US9559283B2Jan 31, 2017
Integrated circuit cooling using embedded peltier micro-vias in substrate
IBM1 citations52
US9941458B2Apr 10, 2018
Integrated circuit cooling using embedded peltier micro-vias in substrate
IBM0 citations42
GLOBALFOUNDRIES INC
10 patentsUS10049570B2Aug 14, 2018
Controlling right-of-way for priority vehicles
GLOBALFOUNDRIES INC8 citations84
US9871020B1Jan 16, 2018
Through silicon via sharing in a 3D integrated circuit
GLOBALFOUNDRIES INC4 citations73
US10249590B2Apr 2, 2019
Stacked dies using one or more interposers
GLOBALFOUNDRIES INC1 citations62
US10043962B2Aug 7, 2018
Thermoelectric cooling using through-silicon vias
GLOBALFOUNDRIES INC1 citations52
US9585257B2Feb 28, 2017
Method of forming a glass interposer with thermal vias
GLOBALFOUNDRIES INC0 citations52
US9496234B1Nov 15, 2016
Wafer-level chip-scale package structure utilizing conductive polymer
GLOBALFOUNDRIES INC0 citations51
US10304763B2May 28, 2019
Producing wafer level packaging using leadframe strip and related device
GLOBALFOUNDRIES INC0 citations47
US9892999B2Feb 13, 2018
Producing wafer level packaging using leadframe strip and related device
GLOBALFOUNDRIES INC0 citations47
US10013519B2Jul 3, 2018
Performance matching in three-dimensional (3D) integrated circuit (IC) using back-bias compensation
GLOBALFOUNDRIES INC0 citations42
US9952500B2Apr 24, 2018
Adjusting of patterns in design layout for optical proximity correction
GLOBALFOUNDRIES INC0 citations42
GEN ELECTRIC
7 patentsUS9008278B2Apr 14, 2015
Multilayer X-ray source target with high thermal conductivity
GEN ELECTRIC36 citations93
US10208587B1Feb 19, 2019
System and method for monitoring integrity of a wellbore
GEN ELECTRIC7 citations83
US10120102B2Nov 6, 2018
Fluid sensor cable assembly, system, and method
GEN ELECTRIC9 citations83
US10634890B1Apr 28, 2020
Miniaturized microscope for phase contrast and multicolor fluorescence imaging
GEN ELECTRIC6 citations72
US9068927B2Jun 30, 2015
Laboratory diffraction-based phase contrast imaging technique
GEN ELECTRIC1 citations51
US9869607B2Jan 16, 2018
Systems and methods for distributed measurement
GEN ELECTRIC0 citations50
US10400574B2Sep 3, 2019
Apparatus and method for inspecting integrity of a multi-barrier wellbore
GEN ELECTRIC0 citations41