Inventor

CHANG CHIEN SHANG-YU

TW52 patents

⚠️ This page may combine multiple inventors who share the name “CHANG CHIEN SHANG-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG CHIEN SHANG-YU

POWERTECH TECHNOLOGY INC

Package structure and manufacturing method thereof

Test method for a redistribution layer

Package structure having a first connection circuit and manufacturing method thereof

Packaging structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Chip package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure including at least one connecting module and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

Manufacturing method of package structure

Chip structure, semiconductor package, and fabricating method thereof

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Chip package structure using silicon interposer as interconnection bridge

Manufacturing method of chip package structure comprising encapsulant having concave surface

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Stacked package structure including a chip disposed on a redistribution layer and a molding layer comprises a recess

Integrated antenna package structure and manufacturing method thereof

Fan-out semiconductor package and method for manufacturing the same

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package comprising plurality of bumps and fabricating method

Package structure including multiple dies surrounded by conductive element and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package with conductive via in encapsulation connecting to conductive element

Semiconductor package structure with circuit substrate and manufacturing method thereof

Package structure and method of manufacturing the same

Method thereof of package structure

Testing method of packaging process and packaging structure

Chip package structure comprising encapsulant having concave surface

Test method for a redistribution layer

Chip-middle type fan-out panel-level package and packaging method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

GLOBAL MIXED MODE TECHNOLOGY INC

LED dimming control circuit

APTOS TECHNOLOGY INC

Optoelectronic package and method of manufacturing the same

POWERTECH TECH INC

Package device and manufacturing method thereof