Inventor
YIP HENG KEONG
MY12 patents
⚠️ This page may combine multiple inventors who share the name “YIP HENG KEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
9 patentsUS7955953B2Jun 7, 2011
Method of forming stacked die package
FREESCALE SEMICONDUCTOR INC8 citations83
US7741196B2Jun 22, 2010
Semiconductor wafer with improved crack protection
FREESCALE SEMICONDUCTOR INC9 citations83
US7531383B2May 12, 2009
Array quad flat no-lead package and method of forming same
FREESCALE SEMICONDUCTOR INC9 citations83
US7473586B1Jan 6, 2009
Method of forming flip-chip bump carrier type package
FREESCALE SEMICONDUCTOR INC15 citations83
US7384819B2Jun 10, 2008
Method of forming stackable package
FREESCALE SEMICONDUCTOR INC16 citations83
US7494924B2Feb 24, 2009
Method for forming reinforced interconnects on a substrate
FREESCALE SEMICONDUCTOR INC2 citations58
US7282395B2Oct 16, 2007
Method of making exposed pad ball grid array package
FREESCALE SEMICONDUCTOR INC0 citations50
US7566648B2Jul 28, 2009
Method of making solder pad
FREESCALE SEMICONDUCTOR INC1 citations47
US9331046B2May 3, 2016
Integrated circuit package with voltage distributor
FREESCALE SEMICONDUCTOR INC0 citations46