Inventor
HU SIPING
CN15 patents
⚠️ This page may combine multiple inventors who share the name “HU SIPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YANGTZE MEMORY TECH CO LTD
12 patentsUS11495569B2Nov 8, 2022
Metal-dielectric bonding method and structure
YANGTZE MEMORY TECH CO LTD3 citations71
US11450653B2Sep 20, 2022
Bonded three-dimensional memory devices having bonding layers
YANGTZE MEMORY TECH CO LTD4 citations70
US11233041B2Jan 25, 2022
Bonded three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD3 citations70
US12136599B2Nov 5, 2024
Three-dimensional memory devices and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD0 citations60
US12080697B2Sep 3, 2024
Method for forming a three-dimensional (3D) memory device having bonded semiconductor structures
YANGTZE MEMORY TECH CO LTD0 citations60
US11978719B2May 7, 2024
Metal-dielectric bonding method and structure
YANGTZE MEMORY TECH CO LTD0 citations60
US11798913B2Oct 24, 2023
Metal-dielectric bonding method and structure
YANGTZE MEMORY TECH CO LTD0 citations60
US11037945B2Jun 15, 2021
Bonded three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD1 citations60
US11842911B2Dec 12, 2023
Wafer stress control using backside film deposition and laser anneal
YANGTZE MEMORY TECH CO LTD0 citations53
US12133386B2Oct 29, 2024
Contact pads of three-dimensional memory device and fabrication method thereof
YANGTZE MEMORY TECH CO LTD0 citations50
US12089406B2Sep 10, 2024
Three-dimensional memory device comprising contact pads exposed by an opening passing through layer stack and fabrication method thereof
YANGTZE MEMORY TECH CO LTD0 citations50
US12507406B2Dec 23, 2025
3D memory device
YANGTZE MEMORY TECH CO LTD0 citations48