Inventor
KIM JEONGSEOK
KR26 patents
⚠️ This page may combine multiple inventors who share the name “KIM JEONGSEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
25 patentsUS11581284B2Feb 14, 2023
Semiconductor package with under-bump metal structure
SAMSUNG ELECTRONICS CO LTD4 citations73
US11569175B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations72
US12261105B2Mar 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations63
US12519051B2Jan 6, 2026
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12394708B2Aug 19, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12278191B2Apr 15, 2025
Semiconductor packages having wiring patterns
SAMSUNG ELECTRONICS CO LTD0 citations62
US12046562B2Jul 23, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12021020B2Jun 25, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11562966B2Jan 24, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12183665B2Dec 31, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12040297B2Jul 16, 2024
Methods of manufacturing semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations61
US11916002B2Feb 27, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US11569158B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations61
US12119305B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11398420B2Jul 26, 2022
Semiconductor package having core member and redistribution substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US11153517B2Oct 19, 2021
Dynamic vision sensor device including buffer
SAMSUNG ELECTRONICS CO LTD0 citations60
US12069352B2Aug 20, 2024
Vision sensor and operating method thereof
SAMSUNG ELECTRONICS CO LTD1 citations59
US11700438B2Jul 11, 2023
Vision sensor and operating method thereof
SAMSUNG ELECTRONICS CO LTD1 citations59
US11902673B2Feb 13, 2024
Electronic device for compensating for time delay of dynamic vision sensor
SAMSUNG ELECTRONICS CO LTD1 citations56
US12593684B2Mar 31, 2026
Semiconductor package including heat dissipation structure
SAMSUNG ELECTRONICS CO LTD0 citations51
US12159826B2Dec 3, 2024
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US11721620B2Aug 8, 2023
Fan-out type semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12111206B2Oct 8, 2024
Vision sensor including a voltage generation circuit for outputting a test bias voltage to a transistor and operating method thereof
SAMSUNG ELECTRONICS CO LTD0 citations50
US11388361B2Jul 12, 2022
Image sensor, imaging device including image sensor, and method of operating imaging device
SAMSUNG ELECTRONICS CO LTD0 citations50
US11728283B2Aug 15, 2023
Package substrate and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations45