Inventor

RESTAINO DARRYL

US6 patents

⚠️ This page may combine multiple inventors who share the name “RESTAINO DARRYL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SIEMENS AG

2 patents

US5872694AFeb 16, 1999

Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage

SIEMENS AG64 citations94

US5798301AAug 25, 1998

Method of manufacturing metal interconnect structure for an integrated circuit with improved electromigration reliability

SIEMENS AG18 citations88

TOSHIBA KK

1 patent

US6140236AOct 31, 2000

High throughput A1-Cu thin film sputtering process on small contact via for manufacturable beol wiring

TOSHIBA KK39 citations91

SIEMENS COMP INC

1 patent

US5641992AJun 24, 1997

Metal interconnect structure for an integrated circuit with improved electromigration reliability

SIEMENS COMP INC15 citations78

INFINEON TECHNOLOGIES AG

1 patent

US7691736B2Apr 6, 2010

Minimizing low-k dielectric damage during plasma processing

INFINEON TECHNOLOGIES AG2 citations62

IBM

1 patent

US6806182B2Oct 19, 2004

Method for eliminating via resistance shift in organic ILD

IBM2 citations59