Inventor
MIYAMOTO TAKAAKI
JP31 patents
⚠️ This page may combine multiple inventors who share the name “MIYAMOTO TAKAAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
30 patentsUS6380065B1Apr 30, 2002
Interconnection structure and fabrication process therefor
SONY CORP69 citations96
US5831335ANov 3, 1998
Semiconductor device contains refractory metal or metal silicide with less than 1% weight of halogen atom
SONY CORP67 citations96
US5747384AMay 5, 1998
Process of forming a refractory metal thin film
SONY CORP61 citations96
US6143377ANov 7, 2000
Process of forming a refractory metal thin film
SONY CORP17 citations92
US6114764ASep 5, 2000
Semiconductor device and process for fabricating the same
SONY CORP19 citations92
US6040021AMar 21, 2000
Plasma CVD process for metal films and metal nitride films
SONY CORP51 citations92
US7470004B2Dec 30, 2008
Liquid ejection head and liquid ejection device
SONY CORP16 citations84
US6536877B2Mar 25, 2003
Printer, printer head, and method for fabricating printer head formed with a multilayer wiring pattern
SONY CORP18 citations84
US6331485B1Dec 18, 2001
Method of producing semiconductor device
SONY CORP17 citations84
US6284649B1Sep 4, 2001
Chemical vapor phase growing method of a metal nitride film and a method of manufacturing an electronic device using the same
SONY CORP18 citations84
US5981388ANov 9, 1999
Plasma CVD method for forming a semiconductor device having metal film formed thereby
SONY CORP17 citations84
US6685304B2Feb 3, 2004
Printer, printer head and method of producing the print head to promote reliable bonding of print head structures
SONY CORP8 citations74
US6337515B1Jan 8, 2002
Wiring structure in semiconductor device and method for forming the same
SONY CORP6 citations74
US5840628ANov 24, 1998
Plasma CVD method for depositing tin layer
SONY CORP15 citations74
US7028402B2Apr 18, 2006
Method of manufacturing a liquid dispenser
SONY CORP6 citations73
US5962084AOct 5, 1999
Plasma CVD process and semiconductor device having metal film formed by the process
SONY CORP11 citations73
US7690768B2Apr 6, 2010
Liquid ejecting head and liquid ejecting apparatus
SONY CORP6 citations63
US7537311B2May 26, 2009
Method and apparatus for ejecting liquid
SONY CORP3 citations63
US7410247B2Aug 12, 2008
Liquid ejection head and liquid ejection apparatus
SONY CORP3 citations63
US7334878B2Feb 26, 2008
Liquid ejection head and liquid ejection apparatus
SONY CORP3 citations63
US6624062B2Sep 23, 2003
Wiring structure in semiconductor device and method for forming the same
SONY CORP2 citations63
US6592209B2Jul 15, 2003
Printer, printer head, and method of producing the printer head
SONY CORP2 citations62
US7261393B2Aug 28, 2007
Liquid jetting head, liquid jetting apparatus, and method of manufacturing the liquid jetting head
SONY CORP2 citations61
US6773091B2Aug 10, 2004
Liquid discharge device and method of manufacturing the same
SONY CORP3 citations61
US7836598B2Nov 23, 2010
Method of manufacturing a thermal liquid jet head using an etching process
SONY CORP0 citations52
US7431430B2Oct 7, 2008
Liquid ejecting head having selectively controlled heat-energy evolving element regions
SONY CORP1 citations52
US7182440B2Feb 27, 2007
Liquid jet apparatus
SONY CORP0 citations52
US7066571B2Jun 27, 2006
Liquid ejection apparatus
SONY CORP0 citations52
US6513912B2Feb 4, 2003
Heat generating element for printer head and manufacturing method therefor
SONY CORP0 citations52
US6848770B2Feb 1, 2005
Liquid dispenser and printer
SONY CORP0 citations51