Inventor
MIKADO YUKINOBU
JP39 patents
⚠️ This page may combine multiple inventors who share the name “MIKADO YUKINOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
18 patentsUS7834273B2Nov 16, 2010
Multilayer printed wiring board
IBIDEN CO LTD41 citations96
US6242079B1Jun 5, 2001
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD67 citations96
US7423219B2Sep 9, 2008
Flex-rigid wiring board
IBIDEN CO LTD132 citations94
US7957154B2Jun 7, 2011
Multilayer printed circuit board
IBIDEN CO LTD26 citations92
US7929313B2Apr 19, 2011
Method of manufacturing multilayer printed circuit board
IBIDEN CO LTD17 citations92
US7759582B2Jul 20, 2010
Multilayer printed wiring board
IBIDEN CO LTD29 citations92
US9215805B2Dec 15, 2015
Wiring board with built-in electronic component and method for manufacturing the same
IBIDEN CO LTD8 citations82
US7973249B2Jul 5, 2011
Multilayer printed wiring board
IBIDEN CO LTD6 citations74
US10143092B2Nov 27, 2018
Circuit substrate and method for manufacturing the same
IBIDEN CO LTD6 citations73
US9831163B2Nov 28, 2017
Circuit substrate and method for manufacturing the same
IBIDEN CO LTD2 citations73
US9232656B2Jan 5, 2016
Wiring board and method for manufacturing the same
IBIDEN CO LTD4 citations73
US9439289B2Sep 6, 2016
Wiring board and method for manufacturing the same
IBIDEN CO LTD4 citations72
US9204552B2Dec 1, 2015
Printed wiring board
IBIDEN CO LTD3 citations63
US9044830B2Jun 2, 2015
Method for forming cavity, apparatus for forming cavity, method for manufacturing circuit board, and circuit board
IBIDEN CO LTD3 citations63
US9119322B2Aug 25, 2015
Wiring board and method for manufacturing the same
IBIDEN CO LTD1 citations52
US7902463B2Mar 8, 2011
Printed wiring board and method of manufacturing the same
IBIDEN CO LTD0 citations52
US9883592B2Jan 30, 2018
Wiring board and method for manufacturing the same
IBIDEN CO LTD0 citations51
US11277923B2Mar 15, 2022
Printed wiring board and method for manufacturing printed wiring board
IBIDEN CO LTD0 citations41
ITO SOTARO
8 patentsUS8101868B2Jan 24, 2012
Multilayered printed circuit board and method for manufacturing the same
ITO SOTARO37 citations95
US8168893B2May 1, 2012
Multilayer wiring board with concave portion for accomodating electronic component
ITO SOTARO23 citations92
US9027238B2May 12, 2015
Multilayered printed circuit board and method for manufacturing the same
ITO SOTARO8 citations83
US8692132B2Apr 8, 2014
Multilayered printed circuit board and method for manufacturing the same
ITO SOTARO5 citations83
US8320135B2Nov 27, 2012
Multilayer printed circuit board
ITO SOTARO10 citations83
US8973259B2Mar 10, 2015
Method for manufacturing a multilayered circuit board
ITO SOTARO2 citations62
US8912451B2Dec 16, 2014
Multilayered printed circuit board and method for manufacturing the same
ITO SOTARO1 citations62
US8705248B2Apr 22, 2014
Multilayer printed circuit board
ITO SOTARO3 citations62
MIKADO YUKINOBU
5 patentsUS8093502B2Jan 10, 2012
Flex-rigid wiring board and manufacturing method thereof
MIKADO YUKINOBU31 citations90
US8829357B2Sep 9, 2014
Wiring board and method for manufacturing the same
MIKADO YUKINOBU17 citations83
US8908387B2Dec 9, 2014
Wiring board and method for manufacturing the same
MIKADO YUKINOBU3 citations62
US8693209B2Apr 8, 2014
Wiring board and method for manufacturing the same
MIKADO YUKINOBU3 citations62
US9320148B2Apr 19, 2016
Printed wiring board
MIKADO YUKINOBU1 citations50
TAKAHASHI MICHIMASA
4 patentsUS8481424B2Jul 9, 2013
Multilayer printed wiring board
TAKAHASHI MICHIMASA4 citations63
US8212363B2Jul 3, 2012
Multilayer printed wiring board
TAKAHASHI MICHIMASA4 citations63
US8621748B2Jan 7, 2014
Manufacturing method for a printed wiring board
TAKAHASHI MICHIMASA0 citations52
US8181341B2May 22, 2012
Method of forming a multilayer printed wiring board having a bulged via
TAKAHASHI MICHIMASA0 citations52