Inventor
KUMASHIRO YASUSHI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “KUMASHIRO YASUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
11 patentsUS6265782B1Jul 24, 2001
Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
HITACHI CHEMICAL CO LTD99 citations97
US6673441B1Jan 6, 2004
Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
HITACHI CHEMICAL CO LTD55 citations96
US6090468AJul 18, 2000
Multilayer wiring board for mounting semiconductor device and method of producing the same
HITACHI CHEMICAL CO LTD63 citations96
US6838170B2Jan 4, 2005
Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
HITACHI CHEMICAL CO LTD24 citations92
US6621170B2Sep 16, 2003
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
HITACHI CHEMICAL CO LTD29 citations92
US5965269AOct 12, 1999
Adhesive, adhesive film and adhesive-backed metal foil
HITACHI CHEMICAL CO LTD40 citations92
US7700185B2Apr 20, 2010
Insulation material, film, circuit board and method of producing them
HITACHI CHEMICAL CO LTD9 citations84
US6197149B1Mar 6, 2001
Production of insulating varnishes and multilayer printed circuit boards using these varnishes
HITACHI CHEMICAL CO LTD15 citations84
US8040486B2Oct 18, 2011
Ink for forming liquid crystal spacer and liquid crystal display device using such ink
HITACHI CHEMICAL CO LTD1 citations52
US9650528B2May 16, 2017
Liquid composition, and resistor film, resistor element and circuit board
HITACHI CHEMICAL CO LTD0 citations51
US9550940B2Jan 24, 2017
Etching material
HITACHI CHEMICAL CO LTD0 citations37
NAKAKO HIDEO
3 patentsUS9457406B2Oct 4, 2016
Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
NAKAKO HIDEO5 citations69
US9676969B2Jun 13, 2017
Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
NAKAKO HIDEO3 citations67
US8801971B2Aug 12, 2014
Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
NAKAKO HIDEO3 citations60