Inventor
OHMORI TOSHIAKI
JP19 patents
⚠️ This page may combine multiple inventors who share the name “OHMORI TOSHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
13 patentsUS5934566AAug 10, 1999
Washing apparatus and washing method
MITSUBISHI ELECTRIC CORP90 citations97
US5147466ASep 15, 1992
Method of cleaning a surface by blasting the fine frozen particles against the surface
MITSUBISHI ELECTRIC CORP52 citations96
US4974375ADec 4, 1990
Ice particle forming and blasting device
MITSUBISHI ELECTRIC CORP55 citations96
US6048409AApr 11, 2000
Washing apparatus and washing method
MITSUBISHI ELECTRIC CORP73 citations95
US5336356AAug 9, 1994
Apparatus for treating the surface of a semiconductor substrate
MITSUBISHI ELECTRIC CORP55 citations92
US5081068AJan 14, 1992
Method of treating surface of substrate with ice particles and hydrogen peroxide
MITSUBISHI ELECTRIC CORP27 citations92
US5074083ADec 24, 1991
Cleaning device using fine frozen particles
MITSUBISHI ELECTRIC CORP30 citations92
US4986216AJan 22, 1991
Semiconductor manufacturing apparatus
MITSUBISHI ELECTRIC CORP46 citations92
US4868996ASep 26, 1989
Method and apparatus for vapor drying
MITSUBISHI ELECTRIC CORP20 citations82
US4696184ASep 29, 1987
Device for measuring the absolute value of the density of salts in atmosphere
MITSUBISHI ELECTRIC CORP9 citations74
US4820650AApr 11, 1989
Introducing lattice defect with ice particles in semiconductor wafer
MITSUBISHI ELECTRIC CORP17 citations70
US4869090ASep 26, 1989
Method of processing base plate for magnetic disc
MITSUBISHI ELECTRIC CORP15 citations69
US6586345B1Jul 1, 2003
Method of manufacturing a semiconductor device wiring layer having an oxide layer between the polysilicon and silicide layers
MITSUBISHI ELECTRIC CORP3 citations63
TAIYO SANSO CO LTD
4 patentsUS5035750AJul 30, 1991
Processing method for semiconductor wafers
TAIYO SANSO CO LTD56 citations95
US5025597AJun 25, 1991
Processing apparatus for semiconductor wafers
TAIYO SANSO CO LTD58 citations95
US4932168AJun 12, 1990
Processing apparatus for semiconductor wafers
TAIYO SANSO CO LTD60 citations95
US5114748AMay 19, 1992
Method of preparing or rubbing a substrate to be used in a lcd device by spraying it with uniformly sized droplets or frozen water
TAIYO SANSO CO LTD11 citations70