Inventor
BRAND JOSEPH M
US25 patents
Patents
25 patentsUS6210992B1Apr 3, 2001
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC172 citations98
US6008074ADec 28, 1999
Method of forming a synchronous-link dynamic random access memory edge-mounted device
MICRON TECHNOLOGY INC85 citations96
US6383292B1May 7, 2002
Semiconductor device encapsulators
MICRON TECHNOLOGY INC57 citations95
US6706565B2Mar 16, 2004
Methods of forming an integrated circuit device
MICRON TECHNOLOGY INC17 citations92
US6528890B1Mar 4, 2003
Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit
MICRON TECHNOLOGY INC17 citations92
US6521980B1Feb 18, 2003
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC25 citations92
US6498052B2Dec 24, 2002
Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit
MICRON TECHNOLOGY INC17 citations92
US6461894B2Oct 8, 2002
Methods of forming a circuit and methods of preparing an integrated circuit
MICRON TECHNOLOGY INC21 citations92
US6355985B1Mar 12, 2002
Integrated circuit device and synchronous-link dynamic random access memory device
MICRON TECHNOLOGY INC17 citations92
US6399425B1Jun 4, 2002
Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices
MICRON TECHNOLOGY INC21 citations91
US7405487B2Jul 29, 2008
Method and apparatus for removing encapsulating material from a packaged microelectronic device
MICRON TECHNOLOGY INC11 citations84
US7273769B1Sep 25, 2007
Method and apparatus for removing encapsulating material from a packaged microelectronic device
MICRON TECHNOLOGY INC13 citations84
US7306974B2Dec 11, 2007
Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies
MICRON TECHNOLOGY INC7 citations74
US6949838B2Sep 27, 2005
Integrated circuit device
MICRON TECHNOLOGY INC7 citations74
US6114190ASep 5, 2000
Method of forming heat sink and semiconductor chip assemblies
MICRON TECHNOLOGY INC5 citations74
US10403598B2Sep 3, 2019
Methods and system for processing semiconductor device structures
MICRON TECHNOLOGY INC3 citations73
US6395579B2May 28, 2002
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC10 citations73
US6812068B2Nov 2, 2004
Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages
MICRON TECHNOLOGY INC4 citations72
US6423581B1Jul 23, 2002
Method of fabricating an encapsulant lock feature in integrated circuit packaging
MICRON TECHNOLOGY INC4 citations63
US6355506B1Mar 12, 2002
Method of forming heat sink and semiconductor chip assemblies
MICRON TECHNOLOGY INC3 citations63
US10679967B2Jun 9, 2020
Systems enabling lower-stress processing of semiconductor device structures and related structures
MICRON TECHNOLOGY INC1 citations62
US7067905B2Jun 27, 2006
Packaged microelectronic devices including first and second casings
MICRON TECHNOLOGY INC0 citations52
US6908795B2Jun 21, 2005
Method of fabricating an encapsulant lock feature in integrated circuit packaging
MICRON TECHNOLOGY INC0 citations52
US6706560B2Mar 16, 2004
Method of forming heat sink and semiconductor chip assemblies
MICRON TECHNOLOGY INC0 citations52
US6379991B2Apr 30, 2002
Encapsulation methods for semiconductive die packages
MICRON TECHNOLOGY INC0 citations42