Inventor
MULLEN III WILLIAM B
US22 patents
Patents
22 patentsUS5241133AAug 31, 1993
Leadless pad array chip carrier
MOTOROLA INC298 citations99
US5311059AMay 10, 1994
Backplane grounding for flip-chip integrated circuit
MOTOROLA INC198 citations98
US5293067AMar 8, 1994
Integrated circuit chip carrier
MOTOROLA INC142 citations97
US5024372AJun 18, 1991
Method of making high density solder bumps and a substrate socket for high density solder bumps
MOTOROLA INC221 citations97
US5446625AAug 29, 1995
Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface
MOTOROLA INC74 citations96
US5280139AJan 18, 1994
Selectively releasing conductive runner and substrate assembly
MOTOROLA INC101 citations96
US5166774ANov 24, 1992
Selectively releasing conductive runner and substrate assembly having non-planar areas
MOTOROLA INC84 citations96
US6242802B1Jun 5, 2001
Moisture enhanced ball grid array package
MOTOROLA INC72 citations95
US5427865AJun 27, 1995
Multiple alloy solder preform
MOTOROLA INC52 citations95
US5540379AJul 30, 1996
Soldering process
MOTOROLA INC37 citations92
US5177134AJan 5, 1993
Tacking agent
MOTOROLA INC47 citations92
US4889275ADec 26, 1989
Method for effecting solder interconnects
MOTOROLA INC31 citations92
US4598972AJul 8, 1986
High density electrical lead
MOTOROLA INC21 citations82
US5184768AFeb 9, 1993
Solder interconnection verification
MOTOROLA INC19 citations81
US5338391AAug 16, 1994
Method of making a substrate having selectively releasing conductive runners
MOTOROLA INC8 citations74
US4878851ANov 7, 1989
Electrical socket apparatus with temporary housing
MOTOROLA INC10 citations74
US4877569AOct 31, 1989
Method of making a one-piece injection molded battery contact assembly
MOTOROLA INC10 citations74
US5623127AApr 22, 1997
Single alloy solder clad substrate
MOTOROLA INC10 citations73
US4586764AMay 6, 1986
Electrical subassembly structure
MOTOROLA INC18 citations73
US5435481AJul 25, 1995
Soldering process
MOTOROLA INC18 citations70
US4626309ADec 2, 1986
Selective bonding interconnection mask
MOTOROLA INC16 citations70
US4752244AJun 21, 1988
Zero insertion force edge clip interconnect pin
MOTOROLA INC17 citations68