Inventor
HENDRICKS DOUGLAS W
US14 patents
Patents
14 patentsUS5336931AAug 9, 1994
Anchoring method for flow formed integrated circuit covers
MOTOROLA INC353 citations98
US5439162AAug 8, 1995
Direct chip attachment structure and method
MOTOROLA INC162 citations96
US5444303AAug 22, 1995
Wire bond pad arrangement having improved pad density
MOTOROLA INC90 citations94
US5323947AJun 28, 1994
Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement
MOTOROLA INC58 citations94
US5436028AJul 25, 1995
Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards
MOTOROLA INC71 citations93
US5679498AOct 21, 1997
Method for producing high density multi-layer integrated circuit carriers
MOTOROLA INC22 citations92
US5598967AFeb 4, 1997
Method and structure for attaching a circuit module to a circuit board
MOTOROLA INC21 citations92
US4889275ADec 26, 1989
Method for effecting solder interconnects
MOTOROLA INC31 citations92
US5001038AMar 19, 1991
Process for photoimaging a three dimensional printed circuit substrate
MOTOROLA INC23 citations91
US5452656ASep 26, 1995
Apparatus for selectively applying solder paste to multiple types of printed circuit boards
MOTOROLA INC37 citations90
US5800723ASep 1, 1998
Process for fabricating flex circuits and product thereby
MOTOROLA INC36 citations89
US5164022ANov 17, 1992
Method and apparatus for applying solder flux
MOTOROLA INC6 citations73
US5716760AFeb 10, 1998
Method for plating a substrate to eliminate the use of a solder mask
MOTOROLA INC4 citations62
US5296046AMar 22, 1994
Subliming solder flux composition
MOTOROLA INC2 citations62