Inventor

ISMAIL AMINUDDIN

MY3 patents

⚠️ This page may combine multiple inventors who share the name “ISMAIL AMINUDDIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

2 patents

US7554185B2Jun 30, 2009

Flip chip and wire bond semiconductor package

FREESCALE SEMICONDUCTOR INC21 citations85

US7432130B2Oct 7, 2008

Method of packaging semiconductor die without lead frame or substrate

FREESCALE SEMICONDUCTOR INC6 citations58

FOONG CHEE SENG

1 patent

US8643172B2Feb 4, 2014

Heat spreader for center gate molding

FOONG CHEE SENG6 citations70