Inventor
FOONG CHEE SENG
MY37 patents
⚠️ This page may combine multiple inventors who share the name “FOONG CHEE SENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FOONG CHEE SENG
11 patentsUS8860212B1Oct 14, 2014
Fluid cooled semiconductor die package
FOONG CHEE SENG9 citations83
US9202770B1Dec 1, 2015
Non-homogeneous molding of packaged semiconductor devices
FOONG CHEE SENG5 citations72
US8643172B2Feb 4, 2014
Heat spreader for center gate molding
FOONG CHEE SENG6 citations70
US9209147B1Dec 8, 2015
Method of forming pillar bump
FOONG CHEE SENG6 citations69
US9269659B1Feb 23, 2016
Interposer with overmolded vias
FOONG CHEE SENG2 citations62
US9053972B1Jun 9, 2015
Pillar bump formed using spot-laser
FOONG CHEE SENG0 citations51
US9134193B2Sep 15, 2015
Stacked die sensor package
FOONG CHEE SENG1 citations42
US9474162B2Oct 18, 2016
Circuit substrate and method of manufacturing same
FOONG CHEE SENG0 citations41
US9401345B2Jul 26, 2016
Semiconductor device package with organic interposer
FOONG CHEE SENG0 citations41
US9159682B2Oct 13, 2015
Copper pillar bump and flip chip package using same
FOONG CHEE SENG0 citations41
US9177834B2Nov 3, 2015
Power bar design for lead frame-based packages
FOONG CHEE SENG0 citations39
FREESCALE SEMICONDUCTOR INC
10 patentsUS7285855B2Oct 23, 2007
Packaged device and method of forming same
FREESCALE SEMICONDUCTOR INC86 citations98
US6900531B2May 31, 2005
Image sensor device
FREESCALE SEMICONDUCTOR INC53 citations88
US7554185B2Jun 30, 2009
Flip chip and wire bond semiconductor package
FREESCALE SEMICONDUCTOR INC21 citations85
US7452750B2Nov 18, 2008
Capacitor attachment method
FREESCALE SEMICONDUCTOR INC13 citations84
US8049313B2Nov 1, 2011
Heat spreader for semiconductor package
FREESCALE SEMICONDUCTOR INC8 citations76
US7179682B2Feb 20, 2007
Packaged device and method of forming same
FREESCALE SEMICONDUCTOR INC4 citations63
US7432130B2Oct 7, 2008
Method of packaging semiconductor die without lead frame or substrate
FREESCALE SEMICONDUCTOR INC6 citations58
US7566648B2Jul 28, 2009
Method of making solder pad
FREESCALE SEMICONDUCTOR INC1 citations47
US9978669B2May 22, 2018
Packaged semiconductor device having a lead frame and inner and outer leads and method for forming
FREESCALE SEMICONDUCTOR INC0 citations42
US9698093B2Jul 4, 2017
Universal BGA substrate
FREESCALE SEMICONDUCTOR INC0 citations38
NXP USA INC
9 patentsUS9935079B1Apr 3, 2018
Laser sintered interconnections between die
NXP USA INC16 citations82
US12341089B2Jun 24, 2025
Device package substrate structure and method therefor
NXP USA INC0 citations61
US11798871B2Oct 24, 2023
Device package substrate structure and method therefor
NXP USA INC0 citations61
US11018024B2May 25, 2021
Method of fabricating embedded traces
NXP USA INC0 citations60
US11189557B2Nov 30, 2021
Hybrid package
NXP USA INC0 citations59
US10537019B1Jan 14, 2020
Substrate dielectric crack prevention using interleaved metal plane
NXP USA INC1 citations56
US11270972B2Mar 8, 2022
Package with conductive underfill ground plane
NXP USA INC0 citations49
US9997445B2Jun 12, 2018
Substrate interconnections for packaged semiconductor device
NXP USA INC1 citations47
US11908784B2Feb 20, 2024
Packaged semiconductor device assembly
NXP USA INC0 citations46