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Inventor
BAE JEONG-YONG
KR
15 patents
⚠️ This page may combine multiple inventors who share the name “BAE JEONG-YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMES CO LTD
3 patents
US7323080B2
Jan 29, 2008
Apparatus for treating substrate
SEMES CO LTD
32 citations
89
US7617836B2
Nov 17, 2009
System and method for supplying functional water
SEMES CO LTD
10 citations
79
US7154611B2
Dec 26, 2006
Spin etcher with thickness measuring system
SEMES CO LTD
1 citations
44
DNS KOREA CO LTD
2 patents
US6784106B2
Aug 31, 2004
Wafer drying method
DNS KOREA CO LTD
9 citations
69
US6918406B2
Jul 19, 2005
Chemical supply apparatus
DNS KOREA CO LTD
7 citations
68
SAMSUNG ELECTRONICS CO LTD
2 patents
US11361960B2
Jun 14, 2022
Substrate processing apparatus and substrate processing system including the same
SAMSUNG ELECTRONICS CO LTD
0 citations
61
US10707071B2
Jul 7, 2020
Substrate processing apparatus and substrate processing system including the same
SAMSUNG ELECTRONICS CO LTD
0 citations
51
LG ELECTRONICS INC
1 patent
US5873261A
Feb 23, 1999
Accumulator for rotary compressor
LG ELECTRONICS INC
17 citations
83
LEE TAEK YOUB
1 patent
US8714169B2
May 6, 2014
Spin head, apparatus for treating substrate, and method for treating substrate
LEE TAEK YOUB
8 citations
80
JEONG YOUNG-JU
1 patent
US8793898B2
Aug 5, 2014
Apparatus and method for drying substrates
JEONG YOUNG-JU
17 citations
78
PARK SUN YONG
1 patent
US8702365B2
Apr 22, 2014
Substrate processing apparatus and method for transferring substrate for the apparatus
PARK SUN YONG
9 citations
76
DNS KOREA LTD
1 patent
US6757989B2
Jul 6, 2004
Wafer drying apparatus
DNS KOREA LTD
7 citations
65
RHO EUN-SU
1 patent
US9529267B2
Dec 27, 2016
Method for processing a substrate and apparatus for performing the same
RHO EUN-SU
6 citations
61
LEE WOO-SEOK
1 patent
US8257549B2
Sep 4, 2012
Spin head, chuck pin used in the spin head, and method for treating a substrate with the spin head
LEE WOO-SEOK
0 citations
51
KIM YIJUNG
1 patent
US8540854B2
Sep 24, 2013
Apparatus and method for plating substrate
KIM YIJUNG
0 citations
30