Inventor

MYERS BRUCE A

US38 patents

⚠️ This page may combine multiple inventors who share the name “MYERS BRUCE A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MYERS BRUCE A

DELPHI TECH INC

Electronic package and method of cooling electronics

Overmolded electronic package including circuit-carrying substrate

Integrated cooling system for electronic devices

Fluid cooled electronic assembly

Power semiconductor package having integral fluid cooling

Method for forming an electronic assembly

Electronic assembly with solder-bonded heat sink

Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips

Liquid cooled power electronic circuit comprising stacked direct die cooled packages

Fluid-cooled electronic system

Vane integration into motor hub to enhance CD cooling

Chip cooling system

Method of fabricating an electronic package having underfill standoff

Thermally-conductive electrically-insulating polymer-base material

Thermally-capacitive phase change encapsulant for electronic devices

Overmolded circuit board with underfilled surface-mount component and method therefor

Corrosive resistant flip chip thermal management structure

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Circuit assembly with surface-mount IC package and heat sink

Power electronic system with passive cooling

Heat-dissipating component having stair-stepped coolant channels

Heat exchanger equipped with thermal electric device for engine exhaust carbon dioxide collection system

Circuit board with localized stiffener for enhanced circuit component reliability

Polymer encapsulated electrical devices

Carbon dioxide absorbent fluid for a carbon dioxide sequestering system on a vehicle

Thermal transient suppression material and method of production

Integrated circuit package with integral leadframe convector and method therefor

DELCO ELECTRONICS CORP

Method for controlling solder bump height for flip chip integrated circuit devices

Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits

Interface device for thermally coupling an integrated circuit to a heat sink

Flexible circuit interconnector and method of assembly thereof

Electrical connector having energy-formed solder stops and methods of making and using the same

Method and apparatus for through hole substrate printing

Method for applying solder to a fine pitch flip chip pattern

Electrical connector having energy-formed solder stops and methods of making and using the same

Method and apparatus for through hole substrate printing

MYERS BRUCE A

Vehicle system to separate and store carbon dioxide from engine exhaust

OMAN TODD P

Thermally-protected chamber for a temperature-sensitive consumer electronic device