Inventor

CHENGALVA SURESH K

US20 patents

⚠️ This page may combine multiple inventors who share the name “CHENGALVA SURESH K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENGALVA SURESH K

DELPHI TECH INC

Electronic package and method of cooling electronics

Flip chip heat sink package and method

Method for forming an electronic assembly

Fluid cooled encapsulated microelectronic package

Fluid circulator for fluid cooled electronic device

Heat sink electronic package having compliant pedestal

Vane integration into motor hub to enhance CD cooling

Fluid cooled encapsulated microelectronic package

Thermal management of surface-mount circuit devices

Flip chip heat sink package and method

Thermally enhanced electronic module with self-aligning heat sink

Fluid cooled encapsulated microelectronic package

Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels

Cooled electronic assembly and method for cooling a printed circuit board

Heat-dissipating component having stair-stepped coolant channels

Circuit board with localized stiffener for enhanced circuit component reliability

Navigation system that displays other-vehicle information

Integrated circuit package with integral leadframe convector and method therefor

BRANDENBURG SCOTT D

Fluid cooled encapsulated microelectronic package

Self circulating heat exchanger