Inventor

NISHINO KENICHI

JP19 patents

⚠️ This page may combine multiple inventors who share the name “NISHINO KENICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NISHINO KENICHI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Component mounting apparatus and method

Electronic component, component mounting equipment, and component mounting method

Bump bonding unit with tray storage and transport apparatuses

Method and device for sealing IC chip

Method of bonding an external lead and a tool therefor

IC discarding apparatus for flip chip mounting facility

Bonding apparatus for terminal component

TAKEDA CHEMICAL INDUSTRIES LTD

Compression molding apparatus

Composition for producing polyurethane resin at ambient temperature

Thixotropic polyurethane resin compositions

In-mold coating composition

Curable unsaturated polyester dresin composition

PANASONIC CORP

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

TERAOKA SEIKO KK

Commodity sales data processing device

Item registration apparatus and measuring device

TOYOTA MOTOR CO LTD

Unsaturated polyester compositions and molded products therefrom

IWAI HISAYUKI

Curable unsaturated polyester resin composition