Inventor

CHEN WEI-PING

TW30 patents

⚠️ This page may combine multiple inventors who share the name “CHEN WEI-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN WEI-PING

OMNIVISION TECH INC

Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs

Wafer-level hybrid compound lens and method for fabricating same

Camera module having sandwiched lens structure in between two glass substrates

Fingerprint sensor with wafer-bonded microlens array

Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes

Electronic camera module with integral LED and light-pipe illuminator

Wafer level stepped sensor holder

Self-illuminating camera

Optical fingerprint sensor for LCD panel

Structure light module using vertical cavity surface emitting laser array

Suspended lens system having a non-zero optical transmission substrate facing the concave surface of a single-piece lens and wafer-level method for manufacturing the same

Light-shielded cameras and methods of manufacture

Passive speckle-suppressing diffusers and associated methods and illuminators

Endoscope imager and associated method

Structure light module using vertical cavity surface emitting laser array and folding optical element

Camera module having baffle between two glass substrates

Stacked-lens assembly and fabrication method for same

Wide-angle camera using achromatic doublet prism array and method of manufacturing the same

PCB-mountable lens adapter for a PCB-mountable camera module

Compact spacer in multi-lens array module

Wafer-level methods for packing camera modules, and associated camera modules

Wafer-level lens packaging methods, and associated lens assemblies and camera modules

Bezels for die level packaging of camera modules, and associated camera modules and methods

Ultra-small camera module with wide field of view, and associate lens systems and methods

VISERA TECHNOLOGIES CO LTD

Electronic assembly for an image sensing device

LIN CHUN-CHI

Image capture lens module and wafer level packaged image capture devices

HUANG TZU-WEI

Camera module and method for fabricating the same

ZUNG PAI-CHUN PETER

Compact camera module and method for fabricating the same

SOLVIAS AG

Metallocene-based chiral phosphine or arsine ligands

DENG JAU-JAN

Method for forming image sensing device