Inventor
HESCHEL MATTHIAS
DK15 patents
⚠️ This page may combine multiple inventors who share the name “HESCHEL MATTHIAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYMITE AS
10 patentsUS6818464B2Nov 16, 2004
Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
HYMITE AS154 citations98
US7057274B2Jun 6, 2006
Semiconductor structures having through-holes sealed with feed-through metalization
HYMITE AS34 citations92
US7419853B2Sep 2, 2008
Method of fabrication for chip scale package for a micro component
HYMITE AS37 citations91
US7253388B2Aug 7, 2007
Assembly with self-alignment features to position a cover on a substrate that supports a micro component
HYMITE AS16 citations82
US7213978B2May 8, 2007
Optical device receiving substrate and optical device holding carrier
HYMITE AS15 citations80
US7109580B2Sep 19, 2006
Hermetically sealed package for optical, electronic, opto-electronic and other devices
HYMITE AS14 citations80
US7681306B2Mar 23, 2010
Method of forming an assembly to house one or more micro components
HYMITE AS7 citations73
US7081412B2Jul 25, 2006
Double-sided etching technique for semiconductor structure with through-holes
HYMITE AS5 citations73
US7388285B2Jun 17, 2008
Hermetically sealed package for optical, electronic, opto-electronic and other devices
HYMITE AS3 citations58
US7732234B2Jun 8, 2010
Fabrication process for package with light emitting device on a sub-mount
HYMITE AS3 citations56