Inventor
JAERVINEN PAULI
DE7 patents
⚠️ This page may combine multiple inventors who share the name “JAERVINEN PAULI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS10319688B2Jun 11, 2019
Antenna on ceramics for a packaged die
INTEL CORP21 citations93
US10249598B2Apr 2, 2019
Integrated circuit package having wirebonded multi-die stack
INTEL CORP4 citations72
US9972601B2May 15, 2018
Integrated circuit package having wirebonded multi-die stack
INTEL CORP4 citations72
US12237305B2Feb 25, 2025
Integrated circuit package having wirebonded multi-die stack
INTEL CORP0 citations61