Inventor
TSUKAMOTO KATSUHIRO
JP46 patents
⚠️ This page may combine multiple inventors who share the name “TSUKAMOTO KATSUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
45 patentsUS5208473AMay 4, 1993
Lightly doped MISFET with reduced latchup and punchthrough
MITSUBISHI ELECTRIC CORP126 citations98
US5178682AJan 12, 1993
Method for forming a thin layer on a semiconductor substrate and apparatus therefor
MITSUBISHI ELECTRIC CORP661 citations98
US5174881ADec 29, 1992
Apparatus for forming a thin film on surface of semiconductor substrate
MITSUBISHI ELECTRIC CORP448 citations98
US5525821AJun 11, 1996
PN junction trench isolation type semiconductor device
MITSUBISHI ELECTRIC CORP69 citations96
US5478761ADec 26, 1995
Method of producing semiconductor device having first and second type field effect transistors
MITSUBISHI ELECTRIC CORP63 citations96
US5478759ADec 26, 1995
Method of manufacturing semiconductor device with retrograde wells
MITSUBISHI ELECTRIC CORP98 citations96
US5470799ANov 28, 1995
Method for pretreating semiconductor substrate by photochemically removing native oxide
MITSUBISHI ELECTRIC CORP54 citations96
US5427972AJun 27, 1995
Method of making a sidewall contact
MITSUBISHI ELECTRIC CORP81 citations96
US5412237AMay 2, 1995
Semiconductor device with improved element isolation and operation rate
MITSUBISHI ELECTRIC CORP48 citations96
US5258319ANov 2, 1993
Method of manufacturing a MOS type field effect transistor using an oblique ion implantation step
MITSUBISHI ELECTRIC CORP95 citations96
US5141882AAug 25, 1992
Semiconductor field effect device having channel stop and channel region formed in a well and manufacturing method therefor
MITSUBISHI ELECTRIC CORP60 citations96
US5138420AAug 11, 1992
Semiconductor device having first and second type field effect transistors separated by a barrier
MITSUBISHI ELECTRIC CORP73 citations96
US5028560AJul 2, 1991
Method for forming a thin layer on a semiconductor substrate
MITSUBISHI ELECTRIC CORP71 citations96
US4855953AAug 8, 1989
Semiconductor memory device having stacked memory capacitors and method for manufacturing the same
MITSUBISHI ELECTRIC CORP58 citations96
US5466623ANov 14, 1995
Method of making semiconductor integrated circuit having isolation oxide regions with different thickness
MITSUBISHI ELECTRIC CORP21 citations93
US5457339AOct 10, 1995
Semiconductor device for element isolation and manufacturing method thereof
MITSUBISHI ELECTRIC CORP32 citations93
US5293060AMar 8, 1994
Semiconductor device with diffusion well isolation
MITSUBISHI ELECTRIC CORP28 citations93
US5250458AOct 5, 1993
Method for manufacturing semiconductor memory device having stacked memory capacitors
MITSUBISHI ELECTRIC CORP23 citations93
US5061654AOct 29, 1991
Semiconductor integrated circuit having oxide regions with different thickness
MITSUBISHI ELECTRIC CORP26 citations93
US5045901ASep 3, 1991
Double diffusion metal-oxide-semiconductor device having shallow source and drain diffused regions
MITSUBISHI ELECTRIC CORP22 citations93
US5019520AMay 28, 1991
Method for preparing a high mobility, lightly-doped channel mis-type FET with reduced latch up and punchthrough
MITSUBISHI ELECTRIC CORP40 citations93
US4978629ADec 18, 1990
Method of making a metal-oxide-semiconductor device having shallow source and drain diffused regions
MITSUBISHI ELECTRIC CORP26 citations93
US5061975AOct 29, 1991
MOS type field effect transistor having LDD structure
MITSUBISHI ELECTRIC CORP34 citations92
US4916508AApr 10, 1990
CMOS type integrated circuit and a method of producing same
MITSUBISHI ELECTRIC CORP36 citations92
US4707723ANov 17, 1987
Semiconductor device using a refractory metal as an electrode and interconnection
MITSUBISHI ELECTRIC CORP35 citations92
US4931897AJun 5, 1990
Method of manufacturing semiconductor capacitive element
MITSUBISHI ELECTRIC CORP42 citations91
US5047818ASep 10, 1991
Semiconductor memory device having buried structure to suppress soft errors
MITSUBISHI ELECTRIC CORP19 citations82
US4708904ANov 24, 1987
Semiconductor device and a method of manufacturing the same
MITSUBISHI ELECTRIC CORP19 citations82
US6211070B1Apr 3, 2001
Peripheral structure of a chip as a semiconductor device, and manufacturing method thereof
MITSUBISHI ELECTRIC CORP8 citations74
US5945716AAug 31, 1999
Semiconductor wafer and device structure
MITSUBISHI ELECTRIC CORP10 citations74
US5534730AJul 9, 1996
Conductive layer connection structure of a semiconductor device and a method of manufacturing thereof
MITSUBISHI ELECTRIC CORP16 citations74
US5448093ASep 5, 1995
Micro MIS type FET and manufacturing process therefor
MITSUBISHI ELECTRIC CORP8 citations74
US5401671AMar 28, 1995
Method of manufacturing a semiconductor device
MITSUBISHI ELECTRIC CORP13 citations74
US5268321ADec 7, 1993
Method of making DRAM cell having improved radiation protection
MITSUBISHI ELECTRIC CORP7 citations74
US5258321ANov 2, 1993
Manufacturing method for semiconductor memory device having stacked trench capacitors and improved intercell isolation
MITSUBISHI ELECTRIC CORP15 citations74
US5196908AMar 23, 1993
Micro MIS type FET and manufacturing process therefor
MITSUBISHI ELECTRIC CORP11 citations74
US4942448AJul 17, 1990
Structure for isolating semiconductor components on an integrated circuit and a method of manufacturing therefor
MITSUBISHI ELECTRIC CORP9 citations74
US4859615AAug 22, 1989
Semiconductor memory cell capacitor and method for making the same
MITSUBISHI ELECTRIC CORP15 citations74
US4702797AOct 27, 1987
Method of manufacturing semiconductor memory device
MITSUBISHI ELECTRIC CORP16 citations74
US4441932AApr 10, 1984
Process for preparing semiconductor device having active base region implanted therein using walled emitter opening and the edge of dielectric isolation zone
MITSUBISHI ELECTRIC CORP19 citations73
US5883408AMar 16, 1999
Semiconductor memory device and method for making the same
MITSUBISHI ELECTRIC CORP5 citations63
US5652168AJul 29, 1997
Method of forming a semiconductor device having a capacitor with improved element isolation and operation rate
MITSUBISHI ELECTRIC CORP5 citations63
US5330923AJul 19, 1994
Manufacturing process for a micro MIS type FET
MITSUBISHI ELECTRIC CORP2 citations63
US5087588AFeb 11, 1992
Method of making a side wall contact with reactive ion etching
MITSUBISHI ELECTRIC CORP2 citations63
US5023682AJun 11, 1991
Semiconductor memory device
MITSUBISHI ELECTRIC CORP6 citations63