Inventor

JEONG YONGHYUK

KR5 patents

⚠️ This page may combine multiple inventors who share the name “JEONG YONGHYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM YOUNGJOON

1 patent

US8816404B2Aug 26, 2014

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

KIM YOUNGJOON53 citations94

CHOI JOONYOUNG

1 patent

US8546194B2Oct 1, 2013

Integrated circuit packaging system with interconnects and method of manufacture thereof

CHOI JOONYOUNG6 citations70

STATS CHIPPAC PTE LTD

1 patent

US12462084B2Nov 4, 2025

Power envelope analysis for the thermal optimization of multi-chip modules

STATS CHIPPAC PTE LTD0 citations52

STATS CHIPPAC LTD

1 patent

US9318380B2Apr 19, 2016

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

STATS CHIPPAC LTD0 citations50

CHOI DAESIK

1 patent

US9059108B2Jun 16, 2015

Integrated circuit packaging system with interconnects

CHOI DAESIK0 citations50