Inventor
GUO MAO
CN8 patents
Patents
8 patentsUS10192840B2Jan 29, 2019
Ball pad with a plurality of lobes
INTEL CORP2 citations70
US10756072B2Aug 25, 2020
Conductive wire through-mold connection apparatus and method
INTEL CORP4 citations69
US9859255B1Jan 2, 2018
Electronic device package
INTEL CORP6 citations68
US10748873B2Aug 18, 2020
Substrates, assembles, and techniques to enable multi-chip flip chip packages
INTEL CORP3 citations65
US12046581B2Jul 23, 2024
Integrated circuit package with glass spacer
INTEL CORP0 citations60
US11393788B2Jul 19, 2022
Integrated circuit package with glass spacer
INTEL CORP0 citations60
US11373974B2Jun 28, 2022
Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size
INTEL CORP0 citations60
US10872832B2Dec 22, 2020
Pre-molded active IC of passive components to miniaturize system in package
INTEL CORP0 citations36