Inventor

WANG ENBO

CN19 patents

⚠️ This page may combine multiple inventors who share the name “WANG ENBO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG ENBO

YANGTZE MEMORY TECH CO LTD

Through array contact (TAC) for three-dimensional memory devices

Through array contact (TAC) for three-dimensional memory devices

Semiconductor plug protected by protective dielectric layer in three-dimensional memory device and method for forming the same

Inter-deck plug in three-dimensional memory device and method for forming the same

Inter-deck plug in three-dimensional memory device and method for forming the same

Method of fabrication thereof a multi-level vertical memory device including inter-level channel connector

Multi-level vertical memory device including inter-level channel connector

Three-dimensional memory device having semiconductor plug formed using backside substrate thinning

Memory device and forming method thereof

3D NAND memory device and method of forming the same

3D NAND memory device and method of forming the same

3D NAND memory device and method of forming the same

Method for forming contact structures in three-dimensional memory devices

Methods of semiconductor device fabrication

HUAWEI TECH CO LTD

Data transmission method and system, and related apparatus

Data processing method and apparatus

Content encoding pre-synchronization method, device and system

Protocol stack adaptation method and apparatus

Data transmission method and related apparatus to compress data to be transmitted on a network