P

Inventor

NAKAMURA YOSHIFUMI

JP81 patents
⚠️ This page may combine multiple inventors who share the name “NAKAMURA YOSHIFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

22 patents
US6229209B1May 8, 2001

Chip carrier

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD112 citations99
US6559528B2May 6, 2003

Semiconductor device and method for the fabrication thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD59 citations96
US6313532B1Nov 6, 2001

Semiconductor device and method for manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD74 citations96
US6300576B1Oct 9, 2001

Printed-circuit board having projection electrodes and method for producing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD74 citations96
US5547530AAug 20, 1996

Method of manufacturing a ceramic substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD46 citations96
US6914331B2Jul 5, 2005

Semiconductor device having an inductor formed on a region of an insulating film

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD55 citations95
US5370759ADec 6, 1994

Method for producing multilayered ceramic substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD57 citations94
US6372547B2Apr 16, 2002

Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD30 citations93
US6365499B1Apr 2, 2002

Chip carrier and method of manufacturing and mounting the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD29 citations93
US5940679AAug 17, 1999

Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD49 citations93
US7279357B2Oct 9, 2007

Method for fabricating a chip-scale-packaging (CSP) having an inductor

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD30 citations92
US6812573B2Nov 2, 2004

Semiconductor device and method for manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations92
US6694613B2Feb 24, 2004

Method for producing a printed-circuit board having projection electrodes

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations92
US6207550B1Mar 27, 2001

Method for fabricating bump electrodes with a leveling step for uniform heights

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD30 citations92
US5525402AJun 11, 1996

Ceramic substrate and manufacturing method thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD27 citations92
US7250575B2Jul 31, 2007

Wiring board, semiconductor device and display module

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD27 citations91
US6784557B2Aug 31, 2004

Semiconductor device including a diffusion layer formed between electrode portions

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations91
US5407473AApr 18, 1995

Conductive ink

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations82
US5662755ASep 2, 1997

Method of making multi-layered ceramic substrates

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations74
US6924173B2Aug 2, 2005

Semiconductor device and method for the fabrication thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62
US7442074B2Oct 28, 2008

Wiring board and method for producing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations61
US6954001B2Oct 11, 2005

Semiconductor device including a diffusion layer

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations61

HONDA MOTOR CO LTD

11 patents

PANASONIC CORP

4 patents

BROTHER IND LTD

4 patents

NORITSU KOKI CO LTD

3 patents

HITACHI INT ELECTRIC INC

2 patents

FUJINO HITOSHI

2 patents

MARUYA YOSHIMASA

1 patent

NETUREN CO LTD

1 patent

Showing the top 50 of 81 patents by PatentIndex Score.