Inventor
LAM KEN
US24 patents
⚠️ This page may combine multiple inventors who share the name “LAM KEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ATMEL CORP
10 patentsUS8018065B2Sep 13, 2011
Wafer-level integrated circuit package with top and bottom side electrical connections
ATMEL CORP57 citations98
US5216806AJun 8, 1993
Method of forming a chip package and package interconnects
ATMEL CORP53 citations96
US7342308B2Mar 11, 2008
Component stacking for integrated circuit electronic package
ATMEL CORP14 citations92
US5367763ANov 29, 1994
TAB testing of area array interconnected chips
ATMEL CORP44 citations92
US5177863AJan 12, 1993
Method of forming integrated leadouts for a chip carrier
ATMEL CORP52 citations92
US5249728AOct 5, 1993
Bumpless bonding process having multilayer metallization
ATMEL CORP40 citations87
US5612514AMar 18, 1997
Tab test device for area array interconnected chips
ATMEL CORP14 citations74
US7821122B2Oct 26, 2010
Method and system for increasing circuitry interconnection and component capacity in a multi-component package
ATMEL CORP3 citations63
US7626247B2Dec 1, 2009
Electronic package with integral electromagnetic radiation shield and methods related thereto
ATMEL CORP4 citations63
US8022516B2Sep 20, 2011
Metal leadframe package with secure feature
ATMEL CORP0 citations43
LAM KEN
5 patentsUS8455304B2Jun 4, 2013
Routable array metal integrated circuit package fabricated using partial etching process
LAM KEN4 citations61
US8324023B2Dec 4, 2012
Stacked-die electronics package with planar and three-dimensional inductor elements
LAM KEN2 citations61
US8487424B2Jul 16, 2013
Routable array metal integrated circuit package fabricated using partial etching process
LAM KEN1 citations51
US8237266B2Aug 7, 2012
Component stacking for integrated circuit electronic package
LAM KEN0 citations51
US8174099B2May 8, 2012
Leadless package with internally extended package leads
LAM KEN1 citations51