Inventor
BUCH CHINTAN
US15 patents
⚠️ This page may combine multiple inventors who share the name “BUCH CHINTAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
14 patentsUS11281094B2Mar 22, 2022
Method for via formation by micro-imprinting
APPLIED MATERIALS INC2 citations73
US10937726B1Mar 2, 2021
Package structure with embedded core
APPLIED MATERIALS INC3 citations73
US10727083B1Jul 28, 2020
Method for via formation in flowable epoxy materials by micro-imprint
APPLIED MATERIALS INC4 citations73
US11521937B2Dec 6, 2022
Package structures with built-in EMI shielding
APPLIED MATERIALS INC2 citations72
US12374611B2Jul 29, 2025
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US12087679B2Sep 10, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11927885B2Mar 12, 2024
Fluoropolymer stamp fabrication method
APPLIED MATERIALS INC0 citations62
US11881447B2Jan 23, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11862546B2Jan 2, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11798903B2Oct 24, 2023
Methods of forming microvias with reduced diameter
APPLIED MATERIALS INC0 citations62
US11454884B2Sep 27, 2022
Fluoropolymer stamp fabrication method
APPLIED MATERIALS INC0 citations62
US11388822B2Jul 12, 2022
Methods for improved polymer-copper adhesion
APPLIED MATERIALS INC1 citations62
US11315890B2Apr 26, 2022
Methods of forming microvias with reduced diameter
APPLIED MATERIALS INC0 citations62
US11931855B2Mar 19, 2024
Planarization methods for packaging substrates
APPLIED MATERIALS INC0 citations48