Inventor
KIM YEONGSEOK
KR18 patents
⚠️ This page may combine multiple inventors who share the name “KIM YEONGSEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS10297554B2May 21, 2019
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations82
US9922935B2Mar 20, 2018
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD7 citations82
US9929131B2Mar 27, 2018
Method of fabricating a semiconductor package having mold layer with curved corner
SAMSUNG ELECTRONICS CO LTD2 citations71
US9418943B2Aug 16, 2016
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US10115613B2Oct 30, 2018
Method of fabricating a fan-out panel level package and a carrier tape film therefor
SAMSUNG ELECTRONICS CO LTD5 citations70
US12183653B2Dec 31, 2024
Thermal conductive film
SAMSUNG ELECTRONICS CO LTD2 citations69
US11355413B2Jun 7, 2022
Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD4 citations69
US12374575B2Jul 29, 2025
Debonding tape and method of processing semiconductor wafer using the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US10910339B2Feb 2, 2021
Flip chip bonding method
SAMSUNG ELECTRONICS CO LTD0 citations60
US12062633B2Aug 13, 2024
Non-conductive film sheet and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US12525479B2Jan 13, 2026
Substrate loading apparatus, semiconductor manufacturing equipment including the same, and method of manufacturing a semiconductor package using the semiconductor manufacturing equipment
SAMSUNG ELECTRONICS CO LTD0 citations57
US10211163B2Feb 19, 2019
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12040213B2Jul 16, 2024
Processing tape and method of fabricating a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US10147713B2Dec 4, 2018
Semiconductor package having mold layer with curved corner and method of fabricating same
SAMSUNG ELECTRONICS CO LTD0 citations50
US10553546B2Feb 4, 2020
Semiconductor package and semiconductor module
SAMSUNG ELECTRONICS CO LTD0 citations49
US12057425B2Aug 6, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations45