Inventor
MASUDA HISAO
JP6 patents
Patents
6 patentsUS5481137AJan 2, 1996
Semiconductor device with improved immunity to contact and conductor defects
MITSUBISHI ELECTRIC CORP20 citations91
US4877173AOct 31, 1989
Wire bonding apparatus
MITSUBISHI ELECTRIC CORP31 citations91
US4916397AApr 10, 1990
Semiconductor device with bonding pad
MITSUBISHI ELECTRIC CORP22 citations77
US5260604ANov 9, 1993
Semiconductor device with improved immunity to contact and conductor defects
MITSUBISHI ELECTRIC CORP6 citations72
US4982728AJan 8, 1991
Apparatus for assembling semiconductor devices
MITSUBISHI ELECTRIC CORP8 citations72
US5087590AFeb 11, 1992
Method of manufacturing semiconductor devices
MITSUBISHI ELECTRIC CORP10 citations69