Inventor
CHEN LI-CHE
TW29 patents
⚠️ This page may combine multiple inventors who share the name “CHEN LI-CHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VANGUARD INT SEMICONDUCT CORP
12 patentsUS10115626B1Oct 30, 2018
Methods for forming isolation blocks of semiconductor devices, semiconductor devices and methods for manufacturing the same
VANGUARD INT SEMICONDUCT CORP2 citations73
US9502584B1Nov 22, 2016
Vertical diode and fabrication method thereof
VANGUARD INT SEMICONDUCT CORP4 citations73
US10032673B1Jul 24, 2018
Semiconductor devices and methods for manufacturing the same
VANGUARD INT SEMICONDUCT CORP4 citations72
US9972534B1May 15, 2018
Semiconductor devices, through-substrate via structures and methods for forming the same
VANGUARD INT SEMICONDUCT CORP4 citations70
US9799601B1Oct 24, 2017
Fuse elements and methods for forming the same
VANGUARD INT SEMICONDUCT CORP5 citations69
US9391139B1Jul 12, 2016
Top-side contact structure and fabrication method thereof
VANGUARD INT SEMICONDUCT CORP2 citations62
US10615249B2Apr 7, 2020
Capacitor structures and methods for fabricating the same
VANGUARD INT SEMICONDUCT CORP1 citations61
US10937872B1Mar 2, 2021
Semiconductor structures
VANGUARD INT SEMICONDUCT CORP1 citations59
US10170397B2Jan 1, 2019
Semiconductor devices, via structures and methods for forming the same
VANGUARD INT SEMICONDUCT CORP0 citations52
US9548375B1Jan 17, 2017
Vertical diode and fabrication method thereof
VANGUARD INT SEMICONDUCT CORP0 citations52
US10347524B2Jul 9, 2019
Trench isolation structures and methods for forming the same
VANGUARD INT SEMICONDUCT CORP0 citations41
US10276563B2Apr 30, 2019
Semiconductor devices and methods for forming the same
VANGUARD INT SEMICONDUCT CORP0 citations37
UNITED MICROELECTRONICS CORP
8 patentsUS8368153B2Feb 5, 2013
Wafer level package of MEMS microphone and manufacturing method thereof
UNITED MICROELECTRONICS CORP29 citations92
US7368785B2May 6, 2008
MOS transistor device structure combining Si-trench and field plate structures for high voltage device
UNITED MICROELECTRONICS CORP35 citations90
US8553911B2Oct 8, 2013
Diaphragm of MEMS electroacoustic transducer
UNITED MICROELECTRONICS CORP6 citations84
US8345895B2Jan 1, 2013
Diaphragm of MEMS electroacoustic transducer
UNITED MICROELECTRONICS CORP13 citations84
US9499399B2Nov 22, 2016
Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer
UNITED MICROELECTRONICS CORP4 citations72
US8363859B2Jan 29, 2013
Microelectromechanical system microphone package structure
UNITED MICROELECTRONICS CORP3 citations62
US10927000B2Feb 23, 2021
MEMS structure with an etch stop layer buried within inter-dielectric layer
UNITED MICROELECTRONICS CORP0 citations61
US7659501B2Feb 9, 2010
Image-sensing module of image capture apparatus and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations48