Inventor
NISHIGUCHI MASANORI
JP47 patents
Patents
47 patentsUS5214308AMay 25, 1993
Substrate for packaging a semiconductor device
SUMITOMO ELECTRIC INDUSTRIES473 citations99
US5196726AMar 23, 1993
Substrate for packaging a semiconductor device having particular terminal and bump structure
SUMITOMO ELECTRIC INDUSTRIES280 citations99
US5406212AApr 11, 1995
Burn-in apparatus and method for self-heating semiconductor devices having built-in temperature sensors
SUMITOMO ELECTRIC INDUSTRIES123 citations98
US4904012AFeb 27, 1990
Suction device
SUMITOMO ELECTRIC INDUSTRIES130 citations98
US5461261AOct 24, 1995
Semiconductor device with bumps
SUMITOMO ELECTRIC INDUSTRIES80 citations96
US5414370AMay 9, 1995
Burn-in apparatus and method which individually controls the temperature of a plurality of semiconductor devices
SUMITOMO ELECTRIC INDUSTRIES103 citations96
US5387815AFeb 7, 1995
Semiconductor chip module
SUMITOMO ELECTRIC INDUSTRIES60 citations96
US5359285AOct 25, 1994
Method and apparatus for varying temperature and electronic load conditions of a semiconductor device in a burn-in test chamber while performing a burn-in test
SUMITOMO ELECTRIC INDUSTRIES58 citations96
US5302854AApr 12, 1994
Packaging structure of a semiconductor device
SUMITOMO ELECTRIC INDUSTRIES42 citations96
US5298460AMar 29, 1994
Substrate for packaging a semiconductor device
SUMITOMO ELECTRIC INDUSTRIES47 citations96
US5188984AFeb 23, 1993
Semiconductor device and production method thereof
SUMITOMO ELECTRIC INDUSTRIES111 citations96
US5098501AMar 24, 1992
Pickup method and the pickup apparatus for chip-type part
SUMITOMO ELECTRIC INDUSTRIES86 citations96
US5064782ANov 12, 1991
Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing
SUMITOMO ELECTRIC INDUSTRIES70 citations96
US4859269AAug 22, 1989
Chip mounting apparatus
SUMITOMO ELECTRIC INDUSTRIES62 citations96
US5035087AJul 30, 1991
Surface grinding machine
SUMITOMO ELECTRIC INDUSTRIES86 citations94
US4809704AMar 7, 1989
Catheter type sensor
SUMITOMO ELECTRIC INDUSTRIES162 citations94
US5536974AJul 16, 1996
Semiconductor device with light reflecting substrate area
SUMITOMO ELECTRIC INDUSTRIES45 citations93
US5525835AJun 11, 1996
Semiconductor chip module having an electrically insulative thermally conductive thermal dissipator directly in contact with the semiconductor element
SUMITOMO ELECTRIC INDUSTRIES26 citations93
US5339215AAug 16, 1994
Heat sink, method of manufacturing the same, and device of manufacturing the same
SUMITOMO ELECTRIC INDUSTRIES20 citations93
US5324381AJun 28, 1994
Semiconductor chip mounting method and apparatus
SUMITOMO ELECTRIC INDUSTRIES39 citations93
US5262355ANov 16, 1993
Method for packaging a semiconductor device
SUMITOMO ELECTRIC INDUSTRIES26 citations93
US5212880AMay 25, 1993
Apparatus for packaging a semiconductor device
SUMITOMO ELECTRIC INDUSTRIES41 citations93
US5122481AJun 16, 1992
Semiconductor element manufacturing process using sequential grinding and chemical etching steps
SUMITOMO ELECTRIC INDUSTRIES32 citations93
US4908693AMar 13, 1990
Wiring structure of semiconductor pressure sensor
SUMITOMO ELECTRIC INDUSTRIES23 citations93
US4868974ASep 26, 1989
Chip mounting apparatus
SUMITOMO ELECTRIC INDUSTRIES24 citations93
US5401099AMar 28, 1995
Method of measuring junction temperature
SUMITOMO ELECTRIC INDUSTRIES54 citations92
US5327075AJul 5, 1994
Burn-in apparatus and method for semiconductor devices
SUMITOMO ELECTRIC INDUSTRIES38 citations92
US5113622AMay 19, 1992
Apparatus for grinding semiconductor wafer
SUMITOMO ELECTRIC INDUSTRIES78 citations92
US4825684AMay 2, 1989
Method of testing semiconductor pressure sensor
SUMITOMO ELECTRIC INDUSTRIES33 citations92
US5384000AJan 24, 1995
Semiconductor chip mounting method and apparatus
SUMITOMO ELECTRIC INDUSTRIES17 citations82
US5092033AMar 3, 1992
Method for packaging semiconductor device
SUMITOMO ELECTRIC INDUSTRIES21 citations82
US5525548AJun 11, 1996
Process of fixing a heat sink to a semiconductor chip and package cap
SUMITOMO ELECTRIC INDUSTRIES8 citations74
US5447750ASep 5, 1995
Heat sink method of manufacturing the same and device of manufacturing the same
SUMITOMO ELECTRIC INDUSTRIES7 citations74
US5403400AApr 4, 1995
Heat sink method of manufacturing the same and device of manufacturing the same
SUMITOMO ELECTRIC INDUSTRIES7 citations74
US5348214ASep 20, 1994
Method of mounting semiconductor elements
SUMITOMO ELECTRIC INDUSTRIES15 citations74
US5244142ASep 14, 1993
Method of mounting semiconductor elements
SUMITOMO ELECTRIC INDUSTRIES10 citations74
US5165791ANov 24, 1992
Method and apparatus for measuring temperature based on infrared light
SUMITOMO ELECTRIC INDUSTRIES14 citations74
US5157479AOct 20, 1992
Semiconductor device being capable of improving the packing density with a high heat radiation characteristics
SUMITOMO ELECTRIC INDUSTRIES9 citations74
US4965247AOct 23, 1990
Superconducting coil and a method for producing the same
SUMITOMO ELECTRIC INDUSTRIES17 citations74
US4937226AJun 26, 1990
Method for producing a small superconducting solenoid
SUMITOMO ELECTRIC INDUSTRIES7 citations74
US4809536AMar 7, 1989
Method of adjusting bridge circuit of semiconductor pressure sensor
SUMITOMO ELECTRIC INDUSTRIES16 citations74
US5105242AApr 14, 1992
Field effect transistor having schottky contact and a high frequency characteristic
SUMITOMO ELECTRIC INDUSTRIES11 citations73
US4844325AJul 4, 1989
Method and apparatus for die-bonding semiconductor chip bonding
SUMITOMO ELECTRIC INDUSTRIES9 citations73
US5104023AApr 14, 1992
Apparatus for fabrication semiconductor device
SUMITOMO ELECTRIC INDUSTRIES15 citations69
US4981809AJan 1, 1991
Method of forming a mask pattern for the production of transistor
SUMITOMO ELECTRIC INDUSTRIES12 citations67
US5019875AMay 28, 1991
Semiconductor device radiation hardened MESFET
SUMITOMO ELECTRIC INDUSTRIES2 citations63
US5027170AJun 25, 1991
Semiconductor device MESFET with upper and lower layers
SUMITOMO ELECTRIC INDUSTRIES1 citations52