Inventor
WATANABE NORINAGA
JP3 patents
Patents
3 patentsUS5798570AAug 25, 1998
Plastic molded semiconductor package with thermal dissipation means
GOTOH SEISAKUSHO KK43 citations93
US6274408B1Aug 14, 2001
Method for producing a plastic molded semiconductor package
GOTOH SEISAKUSHO KK6 citations70
US6020649AFeb 1, 2000
Plastic molded semiconductor package and a method for producing the same
GOTOH SEISAKUSHO KK8 citations70