Inventor
SUN YOUNG-KYUN
KR4 patents
Patents
4 patentsUS6863109B2Mar 8, 2005
In-line die attaching and curing apparatus for a multi-chip package
SAMSUNG ELECTRONICS CO LTD25 citations90
US7215008B2May 8, 2007
In-line apparatus and method for manufacturing double-sided stacked multi-chip packages
SAMSUNG ELECTRONICS CO LTD13 citations82
US7074646B2Jul 11, 2006
In-line die attaching and curing apparatus for a multi-chip package
SAMSUNG ELECTRONICS CO LTD10 citations71
US7481351B2Jan 27, 2009
Wire bonding apparatus and method for clamping a wire
SAMSUNG ELECTRONICS CO LTD1 citations49