Inventor
CHO KYOUNG-BOK
KR4 patents
Patents
4 patentsUS6863109B2Mar 8, 2005
In-line die attaching and curing apparatus for a multi-chip package
SAMSUNG ELECTRONICS CO LTD25 citations90
US10692833B2Jun 23, 2020
Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same
SAMSUNG ELECTRONICS CO LTD8 citations79
US7074646B2Jul 11, 2006
In-line die attaching and curing apparatus for a multi-chip package
SAMSUNG ELECTRONICS CO LTD10 citations71
US10016833B2Jul 10, 2018
Solder ball mounter
SAMSUNG ELECTRONICS CO LTD1 citations47