Inventor

MACKH GUNTHER

DE26 patents

⚠️ This page may combine multiple inventors who share the name “MACKH GUNTHER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MACKH GUNTHER

INFINEON TECHNOLOGIES AG

Singulation processes

Method of dicing a wafer and semiconductor chip

Chip separation supported by back side trench and adhesive therein

Carrier arrangement and method for processing a carrier by generating a crack structure

Chip comprising a backside metal stack

MOS transistor and ESD protective device each having a settable voltage ratio of the lateral breakdown voltage to the vertical breakdown voltage

Method for producing a MOS transistor and MOS transistor

Semiconductor device and method for manufacturing a plurality of semiconductive devices

Semiconductor chip having a crack stop structure

Integrated circuit, method for acquiring data and measurement system

System and method for integrated inductor

Semiconductor structure and method for making same

Method for manufacturing a plurality of chips

Chip comprising a fill structure

Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements

Wafer and method for processing a wafer

Wafer and method for processing a wafer

Method of dicing a wafer and semiconductor chip

Bonding pad for contacting a device

Through substrate features in semiconductor substrates

MACKH GUNTHER

Through substrate features in semiconductor substrates

Chip comprising a fill structure

Method for fusing a laser fuse and method for processing a wafer

HESS REINHARD

Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements

AHRENS CARSTEN

System and method for integrated inductor

LEUSCHNER RAINER

Method for making conductive interconnects