Inventor
KONG YUNG-CHEOL
KR17 patents
⚠️ This page may combine multiple inventors who share the name “KONG YUNG-CHEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS7379113B2May 27, 2008
Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lens
SAMSUNG ELECTRONICS CO LTD32 citations89
US7484901B2Feb 3, 2009
Image sensor camera module and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations83
US7863702B2Jan 4, 2011
Image sensor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD16 citations81
US7494292B2Feb 24, 2009
Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
SAMSUNG ELECTRONICS CO LTD15 citations80
US12057366B2Aug 6, 2024
Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations71
US11600545B2Mar 7, 2023
Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11069592B2Jul 20, 2021
Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure
SAMSUNG ELECTRONICS CO LTD3 citations71
US10964618B2Mar 30, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations69
US8053714B2Nov 8, 2011
Image sensor module, camera module including the same and electronic device including the camera module
SAMSUNG ELECTRONICS CO LTD2 citations62
US7972889B2Jul 5, 2011
Methods of fabricating camera modules including aligning lenses on transparent substrates with image sensor chips
SAMSUNG ELECTRONICS CO LTD2 citations62
US7550812B2Jun 23, 2009
Camera module and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US10105102B2Oct 23, 2018
Package for processing sensed-data, sensed-data processor, and system for processing sensed-data
SAMSUNG ELECTRONICS CO LTD1 citations51
US8927316B2Jan 6, 2015
Camera module and method of manufacturing the camera module
SAMSUNG ELECTRONICS CO LTD0 citations48