Inventor
YUZAWA HIDEKI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “YUZAWA HIDEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
17 patentsUS6335568B1Jan 1, 2002
Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment
SEIKO EPSON CORP114 citations97
US7230338B2Jun 12, 2007
Semiconductor device that improves electrical connection reliability
SEIKO EPSON CORP14 citations83
US7144758B2Dec 5, 2006
Manufacturing method of semiconductor device, including differently spaced bump electrode arrays
SEIKO EPSON CORP12 citations83
US7081590B2Jul 25, 2006
Wiring board and method of fabricating tape-like wiring substrate
SEIKO EPSON CORP18 citations83
US6551918B2Apr 22, 2003
Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment
SEIKO EPSON CORP15 citations83
US7872358B2Jan 18, 2011
Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
SEIKO EPSON CORP3 citations62
US7525200B2Apr 28, 2009
Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
SEIKO EPSON CORP3 citations62
US7279794B2Oct 9, 2007
Semiconductor device and electronic device, and methods for manufacturing thereof
SEIKO EPSON CORP5 citations62
US7208840B2Apr 24, 2007
Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module
SEIKO EPSON CORP2 citations62
US7154187B2Dec 26, 2006
Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
SEIKO EPSON CORP1 citations62
US6905915B2Jun 14, 2005
Semiconductor device and method of manufacturing the same, and electronic instrument
SEIKO EPSON CORP6 citations62
US6731511B2May 4, 2004
Wiring board, method of manufacturing the same, electronic component, and electronic instrument
SEIKO EPSON CORP4 citations62
US6040093AMar 21, 2000
Method and transferring conductor patterns to a film carrier, and masks and film carriers to be used therefor
SEIKO EPSON CORP2 citations62
US7560814B2Jul 14, 2009
Semiconductor device that improves electrical connection reliability
SEIKO EPSON CORP2 citations61
US7786598B2Aug 31, 2010
Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
SEIKO EPSON CORP0 citations51
US7598730B2Oct 6, 2009
Semiconductor wafer examination method and semiconductor chip manufacturing method
SEIKO EPSON CORP0 citations50
US7573256B2Aug 11, 2009
Semiconductor wafer examination method and semiconductor chip manufacturing method
SEIKO EPSON CORP0 citations50